2016
DOI: 10.1016/j.corsci.2016.04.015
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A novel combination approach for the preparation of superhydrophobic surface on copper and the consequent corrosion resistance

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Cited by 175 publications
(62 citation statements)
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“…This method is capable of providing information about corrosion rate, corrosion mechanisms, and even the susceptibility of materials to corrosion under stimulated environments [19,92]. The working mechanism of polarization method involves varying the potential of the test sample, which acts as the working electrode, and plotting the current produced as a function of either potential or time [93][94][95].…”
Section: Potentiodynamic Polarization Methodsmentioning
confidence: 99%
“…This method is capable of providing information about corrosion rate, corrosion mechanisms, and even the susceptibility of materials to corrosion under stimulated environments [19,92]. The working mechanism of polarization method involves varying the potential of the test sample, which acts as the working electrode, and plotting the current produced as a function of either potential or time [93][94][95].…”
Section: Potentiodynamic Polarization Methodsmentioning
confidence: 99%
“…Liu et al [18] created a superhydrophobic surface on AZ91D magnesium alloy by a nickel plating process and the contact angle reached 160.8°. Liu et al [25] combined etching and calcination treatment processes to prepare superhydrophobic surfaces on copper and the synthesized superhydrophobic surface owned a contact angle of 157.6°. The superhydrophobic copper surface Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.…”
Section: Introductionmentioning
confidence: 99%
“…Several ways for enhancing the corrosion protection were discussed in the literature, including the formation of thick oxide films and the formation of a superhydrophobic layer atop of bulk copper . As for oxide films on copper and copper alloys, typically the ionic state of copper can be either monovalent or divalent, associated with the formation of cuprous oxide Cu 2 O or cupric oxide CuO, respectively.…”
Section: Introductionmentioning
confidence: 99%