1989
DOI: 10.1007/bf00616992
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A model for phosphorus segregation at the silicon-silicon dioxide interface

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Cited by 92 publications
(40 citation statements)
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“…The effective dopant concentration is then decreased at the center of the island. Segregation, a process highly dependent on oxidation conditions [33], may also happen and dielectric screening at the interface may contribute to the localization at the sidewalls, in a manner that is dependent on processing conditions. The presence of impurity traps in a highly doped silicon device is thus not unusual.…”
Section: A2 Localizationmentioning
confidence: 99%
“…The effective dopant concentration is then decreased at the center of the island. Segregation, a process highly dependent on oxidation conditions [33], may also happen and dielectric screening at the interface may contribute to the localization at the sidewalls, in a manner that is dependent on processing conditions. The presence of impurity traps in a highly doped silicon device is thus not unusual.…”
Section: A2 Localizationmentioning
confidence: 99%
“…The high surface concentration may result not only from direct surface doping, but also from surface segregation of P atoms, which has been predicted to occur in Si nanowires (Fernandez-Serra, Adessi et al 2006;Peelaers, Partoens et al 2006) and has been extensively studied in thin films (Nutzel and Abstreiter 1996;Thompson and Jernigan 2007). Specifically, the segregation of P to the Si-SiO interface (Lau, Mader et al 1989). The stability of this interfacial excess upon annealing, has been observed before in Si thin films (Schwarz, Barton et al 1981).…”
Section: Obtaining Uniform Dopant Distribution In Si Nanowiresmentioning
confidence: 99%
“…• Correct modeling of dopant profiles especially at material boundaries [17], at high concentration [18] or after ion implantation [19] • Doping activation and deactivation phenomena • Amorphization and recrystallization [20] • Mechanical stress and dislocation formation [21,22] • Processing and geometry dependence of the hysteretic properties of ferroelectric and ferromagnetic materials [23] • Modeling of so called "isolated-nested" effects, i.e. ..loading effects" during plasma deposition and etch [24] • Chemical mechanical polishing [25].…”
Section: Process Simulation Problemsmentioning
confidence: 99%