2013 25th International Symposium on Power Semiconductor Devices &Amp; IC's (ISPSD) 2013
DOI: 10.1109/ispsd.2013.6694437
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A high reliable reverse-conducting IGBT with a floating P-plug

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Cited by 10 publications
(5 citation statements)
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“…In ref [15], a dielectric trench and a floating P-region are introduced at the collector region (TFP RC-IGBT) to eliminate the snapback by the increase of the collector resistance. In ref [16,17], an oxide plug and P-float have been introduced in the collector as an electron barrier in the unipolar mode to suppress the snapback by the increase of the V PN between the P-Collector/ N-buffer junction. Additionally, the Trench Oxide Layer (TOL) technology with (Enhanced Bulk Field) ENBULF theory [18,19,20,21] and the (Reduced Surface Field) RESURF [22, 23,24,24,25,26] theory is widely applied to increase the breakdown voltage (BV) by the modulation of the electric field between the bulk and the surface [27,28,29,30].…”
Section: Introductionmentioning
confidence: 99%
“…In ref [15], a dielectric trench and a floating P-region are introduced at the collector region (TFP RC-IGBT) to eliminate the snapback by the increase of the collector resistance. In ref [16,17], an oxide plug and P-float have been introduced in the collector as an electron barrier in the unipolar mode to suppress the snapback by the increase of the V PN between the P-Collector/ N-buffer junction. Additionally, the Trench Oxide Layer (TOL) technology with (Enhanced Bulk Field) ENBULF theory [18,19,20,21] and the (Reduced Surface Field) RESURF [22, 23,24,24,25,26] theory is widely applied to increase the breakdown voltage (BV) by the modulation of the electric field between the bulk and the surface [27,28,29,30].…”
Section: Introductionmentioning
confidence: 99%
“…It integrates the IGBT and the FWD into one monolithic chip by introducing an N-collector in the backside of the active cell region, which substantially reduces the die size [1,2,3,4,5]. However, several drawbacks are observed in the conventional RC-IGBT.…”
Section: Introductionmentioning
confidence: 99%
“…In this paper, a novel RC-IGBT with built-in FWD controlled by MOSFET is proposed (1) to eliminate the snapback (2) to decrease the forward voltage drop (3) to integrate the FWD in the edge termination region.…”
Section: Introductionmentioning
confidence: 99%
“…It can offer a higher power density in IGBT modules and reduce packaging, bonding, and silicon costs in fabrication. However, the conventional RC-IGBT has a well-known snapback phenomenon in the forward conduction, which is induced by the N-Collectors short effect [3,4,5,6,7,8]. Then the advanced separated RC-IGBT is adopted to solve the snapback by extracting the N-Collectors from the P-Collectors, and the FWD region and IGBT region are separated from each other [9,10,11].…”
Section: Introductionmentioning
confidence: 99%