A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package

Abstract

Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion can be avoided. In this work, FIB, SEM, EDX, and AFM are used to identify the root causes of the peeling. The possible root causes are found to be the presence of an extra layer of thickness of 0.14 m and the poly-silicon surface roughness asperity due to prolonged BOE etching time.

Influence of substrate thickness on thermal impedance of microelectronic structures

“…Typically the transient temperature response to a power step or impulse is recorded. Fourier transformation of these data eventually leads to the complex thermal impedance [1,2]. The frequency dependency is visualised most commonly by means of a Nyquist curve, i.e.…”

Dynamic modelling for thermal micro-actuators using thermal networks

“…Dynamic compact thermal networks able to predict the dynamic junction temperature response under any arbitrary set of external cooling conditions have been represented by Christiaens et al [52]. They have been successfully demonstrated for two types of polymer stud grid array (PSGA) packages, the standard PSGA and the thermally enhanced PSGA.…”

Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technology

“…Two main approaches can be distinguished: Christiaens et al [28] start by a heuristic proposal of a single RC multiport network. The topology and complexity of this network is selected by the engineer from his knowledge of the internal structure of the package.…”