2016 IEEE International Electron Devices Meeting (IEDM) 2016
DOI: 10.1109/iedm.2016.7838397
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A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs

Abstract: We successfully implemented a one-transistor (1T) ferroelectric field effect transistor (FeFET) eNVM into a 28nm gate-first super low power (28SLP) CMOS technology platform using two additional structural masks. The electrical baseline properties remain the same for the FeFET integration and the JTAG-controlled 64 kbit memory shows clearly separated states. High temperature retention up to 250 degrees C is demonstrated and endurance up to 10(5) cycles was achieved. The FeFET unique properties make it the best … Show more

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Cited by 267 publications
(166 citation statements)
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“…Therefore this discovery has drastically changed the view on ferroelectric memories [19]. Both the scaling of classical capacitor based memories as well as the realization of FeFET based memories seem to be in reach again [20,21] and even the possibility of making classical DRAM non-volatile has been pointed out recently [22,23]. However, in order to apply the unexpected ferroelectric behavior of hafnium oxide to reliable products a number of fundamental questions need to be answered: the origin of the ferroelectric phase, the control of the influencing process parameters, the device and array concepts as well as the degradation under use conditions.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore this discovery has drastically changed the view on ferroelectric memories [19]. Both the scaling of classical capacitor based memories as well as the realization of FeFET based memories seem to be in reach again [20,21] and even the possibility of making classical DRAM non-volatile has been pointed out recently [22,23]. However, in order to apply the unexpected ferroelectric behavior of hafnium oxide to reliable products a number of fundamental questions need to be answered: the origin of the ferroelectric phase, the control of the influencing process parameters, the device and array concepts as well as the degradation under use conditions.…”
Section: Introductionmentioning
confidence: 99%
“…2,3) Currently, ultrathin HfO 2 films are attainable by atomic layer deposition (ALD) and are already utilized as the major gate stack material for advanced metal-oxide-semiconductor field-effect transistors (MOSFETs) in largely integrated circuits (LSIs). Developments in the fabrication of nonvolatile memories using ferroelectric HfO 2 films are therefore expected to be made in ferroelectric random access memories (FeRAMs), 24,25) ferroelectric gate-FETs (FeFETs), 24,[26][27][28][29][30] and ferroelectric tunneling junctions (FTJs). 31,32) There is a concern that the coercive field (E C ) is close to the breakdown field (E BD ) in ferroelectric HfO 2 films.…”
Section: Introductionmentioning
confidence: 99%
“…The dielectric constant of Si:HfO 2 is lower in comparison to its perovskite counterparts (PZT and SBT). This property of Si:HfO 2 provides flexibility to be used in thin films which further reduces fringing effects …”
Section: Device Descriptionmentioning
confidence: 99%