The ferroelectric properties of ultrathin Y-doped HfO2 films were investigated. Ferroelectricity was demonstrated experimentally in 3 nm-thick Y-doped HfO2 via direct detection of displacement currents during polarization switching. The dependence on the HfO2 thickness within the 30 to 3 nm range revealed that the ferroelectric properties decrease rapidly below a critical thickness. In the ultrathin HfO2 region, methods such as higher Y doping or metal capping annealing were required to further stabilize the ferroelectric phase. These methods could be used to enhance the switchable polarization (Psw) to 35 μC/cm2 in 5 nm- and 10 μC/cm2 in 3 nm-thick Y-doped HfO2. This paper indicates that HfO2 ferroelectricity is scalable even in the ultrathin region.
The dopant-induced ferroelectric HfO2 formation has been systematically investigated by using cation (Sc, Y, Nb, Al, Si, Ge, and Zr) and anion (N) dopants. Both differences and similarities are discussed among various dopants by focusing on two major factors, the oxygen vacancy (Vo) and the dopant ionic size. First, the doping concentration dependence of the remanent polarization in 27 (±2) nm HfO2 films is quantitatively estimated. Then, by comparing the polarization result with the structural transformation in doped HfO2, the pathway of the dopant-induced HfO2 phase transition is discussed among monoclinic, ferroelectric orthorhombic, tetragonal, and cubic phases. Finally, it is addressed that a dopant species independent phase transition route may exist in HfO2 owing to the same kinetic transition process, in which the ferroelectric phase seems to be at an intermediate state between tetragonal and monoclinic phases.
We have examined an origin of the flatband voltage (VFB) shift in metal-oxide-semiconductor capacitors by employing bilayer high-k gate dielectrics consisting of HfO2 and Al2O3 on the interfacial SiO2 layer. We found that the high-k∕SiO2 interface affects the VFB shift through an electrical dipole layer formation at its interface, regardless of the gate electrode materials. Furthermore, we demonstrated that the VFB shift in the metal/high-k gate stack is determined only by the dipole at high-k∕SiO2 interface, while for the Si-based gate it is determined by both gate/high-k and high-k∕SiO2 interfaces.
The electrical properties of ferroelectric Hf-Zr-O ultrathin films, particularly the dependences of remnant polarization, leakage current, coercive field, and breakdown field on the metal composition and film thickness, are systematically examined. Physical analyses show that the Hf-Zr-O films in this experiment consist of polycrystalline grains and contain both ferroelectric and dielectric phases. It is found that changes in metal composition and thickness strongly influence the remnant polarization and the leakage current simultaneously. In contrast, the coercive field was relatively unaffected by these parameters. This particular behavior of the coercive field suggests that the polarization switching in Hf-Zr-O films is predominantly determined by the nature of nanometer-scale ferroelectric domains dispersed in the films.
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