We have examined an origin of the flatband voltage (VFB) shift in metal-oxide-semiconductor capacitors by employing bilayer high-k gate dielectrics consisting of HfO2 and Al2O3 on the interfacial SiO2 layer. We found that the high-k∕SiO2 interface affects the VFB shift through an electrical dipole layer formation at its interface, regardless of the gate electrode materials. Furthermore, we demonstrated that the VFB shift in the metal/high-k gate stack is determined only by the dipole at high-k∕SiO2 interface, while for the Si-based gate it is determined by both gate/high-k and high-k∕SiO2 interfaces.
The electrical properties of ferroelectric Hf-Zr-O ultrathin films, particularly the dependences of remnant polarization, leakage current, coercive field, and breakdown field on the metal composition and film thickness, are systematically examined. Physical analyses show that the Hf-Zr-O films in this experiment consist of polycrystalline grains and contain both ferroelectric and dielectric phases. It is found that changes in metal composition and thickness strongly influence the remnant polarization and the leakage current simultaneously. In contrast, the coercive field was relatively unaffected by these parameters. This particular behavior of the coercive field suggests that the polarization switching in Hf-Zr-O films is predominantly determined by the nature of nanometer-scale ferroelectric domains dispersed in the films.
The temperature dependence of the tunneling transport characteristics of Si diodes with an isoelectronic impurity has been investigated in order to clarify the mechanism of the ON-current enhancement in Si-based tunnel field-effect transistors (TFETs) utilizing an isoelectronic trap (IET). The Al–N complex impurity was utilized for IET formation. We observed three types of tunneling current components in the diodes: indirect band-to-band tunneling (BTBT), trap-assisted tunneling (TAT), and thermally inactive tunneling. The indirect BTBT and TAT current components can be distinguished with the plot described in this paper. The thermally inactive tunneling current probably originated from tunneling consisting of two paths: tunneling between the valence band and the IET trap and tunneling between the IET trap and the conduction band. The probability of thermally inactive tunneling with the Al–N IET state is higher than the others. Utilization of the thermally inactive tunneling current has a significant effect in enhancing the driving current of Si-based TFETs.
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