To realize a stackable complementary metal–oxide–semiconductor field-effect transistor (CMOSFET) on interlayer dielectrics for three-dimensional (3D) large-scale-integration devices, we investigated poly-Ge thin films formed by flash lamp annealing. The process resulted in crystalline grains of micrometer-order size, and the Hall-effect mobility of holes was as high as 200 cm2 V−1 s−1. A depletion-type trigate poly-Ge channel pMOSFET with a gate length of 80 nm formed on a poly-Ge film exhibited a drive current of 280 µA/µm at a drain voltage of −1 V and a gate overdrive of −1 V. The operation of inversion-type short-channel trigate poly-Ge nMOSFETs was also demonstrated.

The temperature dependence of the tunneling transport characteristics of Si diodes with an isoelectronic impurity has been investigated in order to clarify the mechanism of the ON-current enhancement in Si-based tunnel field-effect transistors (TFETs) utilizing an isoelectronic trap (IET). The Al–N complex impurity was utilized for IET formation. We observed three types of tunneling current components in the diodes: indirect band-to-band tunneling (BTBT), trap-assisted tunneling (TAT), and thermally inactive tunneling. The indirect BTBT and TAT current components can be distinguished with the plot described in this paper. The thermally inactive tunneling current probably originated from tunneling consisting of two paths: tunneling between the valence band and the IET trap and tunneling between the IET trap and the conduction band. The probability of thermally inactive tunneling with the Al–N IET state is higher than the others. Utilization of the thermally inactive tunneling current has a significant effect in enhancing the driving current of Si-based TFETs.

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This study alleviates the low operating temperature constraint of Si qubits. A qubit is a key element for quantum sensors, memories, and computers. Electron spin in Si is a promising qubit, as it allows both long coherence times and potential compatibility with current silicon technology. Si qubits have been implemented using gate-defined quantum dots or shallow impurities. However, operation of Si qubits has been restricted to milli-Kelvin temperatures, thus limiting the application of the quantum technology. In this study, we addressed a single deep impurity, having strong electron confinement of up to 0.3 eV, using single-electron tunnelling transport. We also achieved qubit operation at 5–10 K through a spin-blockade effect based on the tunnelling transport via two impurities. The deep impurity was implemented by tunnel field-effect transistors (TFETs) instead of conventional FETs. With further improvement in fabrication and controllability, this work presents the possibility of operating silicon spin qubits at elevated temperatures.

Tunnel field-effect transistors (TFETs) exhibiting a minimum subthreshold swing (SS) of 27 mV/decade were successfully fabricated using conventional planar HfO2/Si-gate-stack structures. However, an unexpected SS degradation with increasing equivalent oxide thickness (EOT) was observed compared with the simulated results obtained under the assumption of ideal band-to-band tunneling. We found that the poor subthreshold operation was governed by a thermally activated process, suggesting trap-assisted tunneling that occurs with traps near the metallurgical pn junction. Furthermore, we discuss the effect of the observed EOT-sensitive SS degradation on device production.

We study quantum interference effects of a qubit whose energy levels are continuously modulated. The qubit is formed by an impurity electron spin in a silicon tunneling field-effect transistor, and it is read out by spin blockade in a double-dot configuration. The qubit energy levels are modulated via its gate-voltage-dependent g-factors, with either rectangular, sinusoidal, or ramp radio-frequency waves. The energy-modulated qubit is probed by the electron spin resonance. Our results demonstrate the potential of spin qubit interferometry implemented in a silicon device and operated at a relatively high temperature.