A 100 nm Thick, 32 kHz X-Cut Lithium Niobate Piezoelectric Nanoscale Ultrasound Transducer for Airborne Ultrasound Communication

Simeoni, Pietro; Schaffer, Zachary; Piazza, Gianluca

doi:10.1109/jmems.2021.3062344

Cited by 7 publications

(5 citation statements)

References 10 publications

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“…e planar multipiece series structure transducer is connected in series in structure, but in the case of the same driving power supply, the positive and negative electrodes of each lithium niobate segment are, respectively, connected to the positive and negative electrodes of the transducer matching circuit; in this way, it can be regarded as equivalent that each lithium niobate segment is connected in parallel. e ultrasonic transducer is a nonlinear capacitive load, and its output voltage and current have a certain phase difference at the operating frequency, and this phase difference makes the output power not reach the expected maximum value [19]. At present, most of the transducer matching methods are as follows: a reverse reactance is connected in parallel or in series at both ends of the transducer, so that the transducer becomes a pure resistance.…”

Section: Impedance Matching Designmentioning

confidence: 99%

Research and Development of Digital Assembly Process System for Ultrasonic Transducers

Feng

Zhu

Zhao

et al. 2022

Security and Communication Networks

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In order to solve the problem of design efficiency of the digital assembly process, the author proposes a research using ultrasonic transducer technology. The main content of this research is to study the ultrasonic transducer elements according to the basic structure of the ultrasonic transducer.Through the study of equivalent circuit of ultrasonic transducer, the model of impedance matching design is constructed. Finally, the feasibility of ultrasonic transducer technology is obtained through experiments. Experimental results show that the transducer multichip structure of the ultrasonic transducer system and the LC matching network circuit can make the AOTF system achieve better results, and the diffraction efficiency is up to more than 70%, which is of great significance to the research and development of the current digital assembly process system. Conclusion. It is proven that the research of ultrasonic transducer technology can meet the needs of digital assembly process design efficiency.

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Section: Impedance Matching Designmentioning

confidence: 99%

Research and Development of Digital Assembly Process System for Ultrasonic Transducers

Feng

Zhu

Zhao

et al. 2022

Security and Communication Networks

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“…It is reported that the mechanical stress steeply transits from ignorable tension to nearly 1500 MPa compression when the AlN thickness decreases from around 1000 nm to 35 nm [167]. As for LiNbO 3 Lamb wave resonators, although the LiNbO 3 thin films experience approximately zero stress, the metal electrodes such as Pt that are utilized can show severe out-ofplane stress [205]. Moreover, the existing stress can be further aggravated by the thermal expansion of piezoelectric thin films.…”

Section: Thin Film Thickness Controlmentioning

confidence: 99%

“…structural strength of Lamb wave resonators, the mechanical stress weakens the resilience to external disturbance, which increases the risk of damage during the transportation or packaging of micromachined piezoelectric Lamb wave devices and lowers production yields [173]. Besides, deformations of the suspended resonance cavities resulting from mechanical stress can cause degeneration of resonator performance [205]. In order to mitigate the impact of mechanical stress generated by thin films, compensating for the stress or reducing external disturbance are two possible directions.…”

Section: Thin Film Thickness Controlmentioning

confidence: 99%

“…Stress compensation through composite layers has been reported in several works. For example, SiO 2 films have been used to effectively compensate for thermally induced stress of suspended AlN Lamb wave resonators [76,78] (figures 13(a) and (b)), while structure optimizations can also efficiently relax mechanical stress [205]. From another perspective, techniques such as wafer level packaging provide efficient protection from external disturbance during the fabrication process for suspended devices with significant inner stress [173,209] (figures 13(c) and (d)).…”

Section: Thin Film Thickness Controlmentioning

confidence: 99%

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Micromachined piezoelectric Lamb wave resonators: a review

Lu,

Ren

2023

J. Micromech. Microeng.

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With the development of next-generation wireless communication and sensing technologies, there is an increasing demand for high-performance and miniaturized resonators. Micromachined piezoelectric Lamb wave resonators are becoming promising candidates because of their multiple vibration modes, lithographically defined frequencies, and small footprint. In the past two decades, micromachined piezoelectric Lamb wave resonators based on various piezoelectric materials and structures have achieved considerable progress in performance and applications. This review focuses on the state-of-the-art Lamb wave resonators based on aluminum nitride (AlN), aluminum scandium nitride (AlxSc1-xN), and lithium niobate (LiNbO3), as well as their applications and further developments. The promises and challenges of micromachined piezoelectric Lamb wave resonators are also discussed. It is promising for micromachined piezoelectric Lamb wave resonators to achieve higher resonant frequencies and performance through advanced fabrication technologies and new structures, the integration of multifrequency devices with radio frequency (RF) electronics as well as new applications through utilizing nonlinearity and spurious modes. However, several challenges, including degenerated electrical and thermal properties of nanometer-scale electrodes, accurate control of film thickness, high thin film stress, and a trade-off between electromechanical coupling efficiencies and resonant frequencies, may limit the commercialization of micromachined piezoelectric Lamb wave resonators and thus need further investigation. Potential mitigations to these challenges are also discussed in detail in this review. Through further painstaking research and development, micromachined piezoelectric Lamb wave resonators may become one of the strongest candidates in the commercial market of RF and sensing applications.

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“…Thanks to the above low-loss, wideband, and highfrequency advantages of the platform, various thin-film LiNbO 3 based acoustic microsystems have been demonstrated in the last decade. The applications range from resonators and filters [69,75,76], transformers [77][78][79], rectifiers [80], delay lines [81][82][83][84][85][86][87], oscillators [88][89][90], ultrasound transducers [91,92], to emerging acoustoelectric amplifiers [93], non-reciprocal networks [94,95], acousto-optic modulators [96][97][98][99], and quantum systems [100]. These demonstrations include both conventional acoustic functions with improved performance and unprecedented acoustic signal processing functions, thanks to the high k 2 of thin-film LiNbO 3 .…”

Section: Introductionmentioning

confidence: 99%

RF acoustic microsystems based on suspended lithium niobate thin films: advances and outlook

Gong

2021

J. Micromech. Microeng.

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This paper presents a review of the radio frequency thin-film lithium niobate (LiNbO3) based acoustic microsystems. Thanks to their high electromechanical coupling (k 2), low loss, and great frequency scalability, thin-film LiNbO3 has outperformed state-of-the-art acoustic technologies in the past decade. This paper first reviews the acoustic wave transduction and propagation in thin-film LiNbO3 and then showcases the emerging acoustic applications. Outlook for further platform development and more functions is offered for future thin-film LiNbO3 based acoustic microsystems development.

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A 100 nm Thick, 32 kHz X-Cut Lithium Niobate Piezoelectric Nanoscale Ultrasound Transducer for Airborne Ultrasound Communication

Cited by 7 publications

References 10 publications

Research and Development of Digital Assembly Process System for Ultrasonic Transducers

Research and Development of Digital Assembly Process System for Ultrasonic Transducers

Micromachined piezoelectric Lamb wave resonators: a review

RF acoustic microsystems based on suspended lithium niobate thin films: advances and outlook

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