52 km-Long Transmission Link Using a 50 Gb/s <i>O</i>-Band Silicon Microring Modulator Co-Packaged With a 1V-CMOS Driver

Moralis-Pegios, Miltiadis; Pitris, Stelios; Alexoudi, Theoni; Ramon, Hannes; Yin, Xin; Bauwelinck, Johan; Ban, Yoojin; Heyn, Peter De; Campenhout, Joris Van; Pleros, Nikos

doi:10.1109/jphot.2019.2921730

Cited by 13 publications

(6 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This result shows large improvement in detection sensitivity of the microwave photonics receiver compared to a traditional electro-optic modulator where the minimum driving power is about 1 × 10 −4 mW. With the microring method, the detection sensitivity has been improved by five orders of magnitude [28], [29]. The power conversion efficiency is around η = 2.54 × 10 2 and the bandwidth is 19.34 MHz, which are 10 times better compared to state-of-art power conversion efficiency [17].…”

Section: Detection Sensitivity and Snrmentioning

confidence: 84%

Method for Receiving Weak Microwave Photonics Signals Based on Electro-Optical Up-Conversion

Zhang

Xie

et al. 2020

IEEE Photonics J.

View full text Add to dashboard Cite

A novel method for receiving weak microwave photonics signals based on a micro-ring resonator is proposed. This approach uses the nonlinear interaction of a microwave and an optical pump to generate an up-conversion signal to achieve the signal reception. The minimum detectable power of this method reaches −89.79 dBm, which is suitable for the detection of weak signals. The power conversion efficiency and bandwidth have a 10 times promotion compared to similar conversion methods at room temperature. The result also demonstrates that the detection sensitivity can be improved by five orders of magnitude compared to the traditional modulators, and the output signal-to-noise ratio can be improved by more than 17 dB using a micro-ring resonator.

show abstract

Section: Detection Sensitivity and Snrmentioning

confidence: 84%

Method for Receiving Weak Microwave Photonics Signals Based on Electro-Optical Up-Conversion

Zhang

Xie

et al. 2020

IEEE Photonics J.

View full text Add to dashboard Cite

show abstract

“…Each socket is equipped with a SiPho WDM TxRx, responsible for optically interfacing the CPU with the server board, by employing multiple RM modulators resonating at different wavelengths while powered from WMD continuous wave (CW) lasers. Figures 4 and 5 depict a time and performance evolution of SiPho Tx and TxRx demonstrations for MSBs, which were developed within the European research project H2020-ICT-STREAMS, progressing from single-lane 50 Gb/s towards WDM layouts that can reach an aggregate bandwidth of 400 Gb/s [11][12][13][14]. More specifically,…”

Section: Sipho Wdm Mid-board Transceiversmentioning

confidence: 99%

“…With EOPCBs typically offering a low waveguide loss figure at the O-band [10] and rather high propagation losses at the C-band, the experimental AWGR-based demonstrations reported so far, almost exclusively in the Cband regime, are not compatible with MSB topologies with >4 sockets. Under these circumstances, we have recently demonstrated the main subsystems that allow for the realization of an O-band MSB optical interconnect [11][12][13][14][15][16][17], including an 8�50 Gb/s O-band silicon photonics (SiPho) TxRx [14], a 16�16 O-band SiPho AWGR [16] and an automated thermal drift compensation system [17].…”

Section: Introductionmentioning

confidence: 99%

Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects

Moralis-Pegios

Pitris

Mitsolidou

et al. 2021

IET Optoelectronics

Self Cite

View full text Add to dashboard Cite

Multi‐socket server boards (MSBs) exploit the interconnection of multiple processor chips towards forming powerful cache coherent systems, with the interconnect technology comprising a key element in boosting processing performance. Here, we present an overview of the current electrical interconnects for MSBs, outlining the main challenges currently faced. We propose the use of silicon photonics (SiPho) towards advancing interconnect throughput, socket connectivity and energy efficiency in MSB layouts, enabling a flat‐topology wavelength division multiplexing (WDM)‐based point‐to‐point (p2p) optical MSB interconnect scheme. We demonstrate WDM SiPho transceivers (TxRxs) co‐assembled with their electronic circuits for up to 50 Gb/s line rate and 400 Gb/s aggregate data transmission and SiPho arrayed waveguide grating routers that can offer collision‐less time of flight connectivity for up to 16 nodes. The capacity can scale to 2.8 Gb/s for an eight‐socket MSB, when line rate scales to 50 Gb/s, yielding up to 69% energy reduction compared with the QuickPath Interconnect and highlighting the feasibility of single‐hop p2p interconnects in MSB systems with >4 sockets.

show abstract

“…The versatile capabilities of the TX-assembly to support not only MSB settings, where the ultra-low loss polymer waveguide technology [12] can be exploited, but also to easily increase the extent of the transmitted signals up to Metropolitan Area Networks (MAN) distances, by exploiting the zero-dispersion window of SSMF for operation at 1300 nm, was verified through the transmission of a 50 Gb/s NRZ signal over 52 km-long SSMF without dispersion-compensation [45]. However, the transition for operation in O-band to achieve long-reach optical links without dispersion compensation comes together with slightlyincreased SSMF (Corning SMF-28e) losses (0.33-0.35 dB/km) compared to C-band (0.19-0.2 dB/km).…”

Section: A Tx Assembly and Experimental Setupmentioning

confidence: 99%

O-Band Silicon Photonic Transmitters for Datacom and Computercom Interconnects

Pitris

Moralis-Pegios

Alexoudi

et al. 2019

J. Lightwave Technol.

Self Cite

View full text Add to dashboard Cite

Today, the datacenter ecosystems are fueling the demand for novel transmitter (TX) technologies complying with the off-board, on-board, and chip-to-chip computing needs. This has set a new class of requirements for the TX infrastructure that should now offer multiple credentials, namely: high-speed, O-band operation for avoiding dispersion compensation in long distances, wavelength-division multiplexing (WDM) capabilities for higher throughput and multicasting/broadcasting support, and tight copackaging with low-power electronics. Silicon (Si) photonic TXs have been extensively studied toward high-speed and WDM TX engines targeting mainly C-band. Only a limited number of Si-Pho O-band TXs have been reported, however with ≤32 Gb/s/channel line-rate capabilities and with a WDM portfolio that has not been fully explored yet. In this paper, we introduce a novel silicon photonic high-speed O-band TX hardware platform that can meet the current datacom and computercom interconnect requirements. We demonstrate a ring modulator (RM) based four-channel WDM TX at 4 × 40 Gb/s non-return-to-zero (NRZ) operation that supports wavelength parallelism in unicast operation but can also pave the way toward WDM TX engines for the post-100 GbE TX era. Moreover, we present a broadband Si Mach-Zehnder modulator employed in a WDM modulation scheme of 2 × 25 Gb/s NRZ signals and demonstrate multicasting when combined with a 8 × 8 passive arrayed waveguide grating router (AWGR) wavelength router, addressing the broadcasting needs of traffic usually encountered in cache-coherent multisocket settings. Finally, we further demonstrate the tight synergy of O-band Si-RM modulators with high-speed CMOS electronics, presenting an RM-based TX assembly prototype employing a fully depleted silicon-on-insulator CMOS driver, delivering 50-Gb/s NRZ operation.

show abstract

52 km-Long Transmission Link Using a 50 Gb/s O-Band Silicon Microring Modulator Co-Packaged With a 1V-CMOS Driver

Cited by 13 publications

References 15 publications

Method for Receiving Weak Microwave Photonics Signals Based on Electro-Optical Up-Conversion

Method for Receiving Weak Microwave Photonics Signals Based on Electro-Optical Up-Conversion

Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects

O-Band Silicon Photonic Transmitters for Datacom and Computercom Interconnects

Contact Info

Product

Resources

About