3D Tunable, Multiscale, and Multistable Vibrational Micro‐Platforms Assembled by Compressive Buckling

Ning, Xin; Wang, Heling; Yu, Xinge; Soares, Julio A. N. T.; Yan, Zheng; Nan, Kewang; Velarde, Gabriel; Xue, Yeguang; Sun, Rujie; Dong, Qi; Luan, Haiwen; Lee, Chan Mi; Chempakasseril, Aditya; Han, Mengdi; Wang, Yiqi; Li, Luming; Huang, Yonggang; Zhang, Yihui; Li, Jinghua

doi:10.1002/adfm.201605914

Cited by 43 publications

(31 citation statements)

References 46 publications

(33 reference statements)

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“…An attractive feature of these strategies is that they are naturally compatible with advanced circuit designs and chip‐scale components, packaged or unpackaged, in conventional and various electronic, optoelectronic, and energy devices. Collectively, these features suggest new opportunities in circuit/system‐level design applicable to 3D dynamic platforms, biological systems, and classes of sensors/actuators …”

Section: Resultsmentioning

confidence: 99%

Mechanically Guided Post‐Assembly of 3D Electronic Systems

Kim

Liu

et al. 2018

Adv Funct Materials

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This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-ofplane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a nearfield communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components. Figure 6. a) Optical image and b) FEA results for an array of 3D FPCB systems fabricated in a single-step, parallel assembly process.

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Section: Resultsmentioning

confidence: 99%

Mechanically Guided Post‐Assembly of 3D Electronic Systems

Kim

Liu

et al. 2018

Adv Funct Materials

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“…[125] Moreover, similar ideas also enable tunable opto/ mechanical systems, including micromirrors [126] with adjustable focal length, optical shutters [34] with controllable transmission values, and mechanical resonators with tunable frequencies. [127] Biological systems are inherently 3D. 3D systems like those reported here could, therefore, serve as the basis for volumetric biointerfaces in fundamental studies or, ultimately, clinical use.…”

Section: Functional 3d Systemsmentioning

confidence: 89%

Assembly of Advanced Materials into 3D Functional Structures by Methods Inspired by Origami and Kirigami: A Review

Ning

Wang

Zhang

et al. 2018

Adv Materials Inter

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213

146

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expand the range of accessible 3D geometries. [5-8] Due to their shape-adaptive nature, origami and kirigami, originally applied only to paper, can serve as routes to large-scale structural systems that require packaging and deployment, such as foldable solar panels, [9,10] retractable roofs, [11] deployable sunshields, [12] and many others. [13] More recent work demonstrates that these and related methods for assembling planar materials into complex 3D structures can exploit sophisticated 2D fabrication technologies and thin film materials from the electronics/optoelectronics industries, to yield functional systems in 3D designs that were previously unachievable. [14-18] In this way, the techniques of origami/kirigami can enable many classes of nontraditional devices not only at the macroscale but also at the micro/ nanoscale, with the potential to open up opportunities for unusual engineering designs in microsystems technologies. [19-22] Much research in origami/kirigami assembly aims to extend the range of length scales and the scope of functional materials that can be realized in 3D systems, and to transfer those ideas and Origami and kirigami, the ancient techniques for making paper works of art, also provide inspiration for routes to structural platforms in engineering applications, including foldable solar panels, retractable roofs, deployable sunshields, and many others. Recent work demonstrates the utility of the methods of origami/kirigami and conceptually related schemes in cutting, folding, and buckling in the construction of devices for emerging classes of technologies, with examples in mechanical/optical metamaterials, stretchable/ conformable electronics, micro/nanoscale biosensors, and large-amplitude actuators. Specific notable progress is in the deployment of functional materials such as single-crystal silicon, shape memory polymers, energy-storage materials, and graphene into elaborate 3D micro and nanoscale architectures. This review highlights some of the most important developments in this field, with a focus on routes to assembly that apply across a range of length scales and with advanced materials of relevance to practical applications. Hall of Fame Article The ORCID identification number(s) for the author(s) of this article can be found under

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“…Unlike other electronic devices, MEMS are often designed to move or oscillate, with the mechanical oscillations generating an electrical output . 3D MEMS offer vastly improved bandwidth and frequency tunability over conventional 2D MEMS structures, such as cantilever beams and doubly clamped bridges . In a recent study, we investigated different resonant vibrational frequencies of 3D table and rotated table structures.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Mechanical Cycling of Polymer Microscale Architectures for 3D MEMS Sensors

et al. 2019

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Biology involves inherently complex three-dimensional designs. In addition to the geometric complexity, thin and complex biostructures composed of membranes such as insects, wings, and plants leaves can achieve complex functionalities under vibrations, such as maneuverability and resistance to strong winds, respectively. They do so by changing the shape and curvature of their membranes and ribbons. Achieving such capabilities in advanced materials would have important implications for a wide range of applications, such as threedimensional (3D) microelectromechanical systems (MEMS), sensors, and energy harvesting devices. Such applications experience cyclic deformation up to 20-30% length compression during operation. To this end, this paper investigates mechanical cycling of a number of microscale 3D polymer-based kirigami architectures. The mechanical response of these structures revealed stable and resilient behavior equivalent to flexible natural systems upon cyclic compression up to 50% of their initial height. To understand crack formation and growth, in situ scanning electron microscopy (SEM) under extreme compression of 100% of their initial heights reveal internal stresses and permanent change in the curvature of the structures, resulting in the formation of cracks after 100 cycles. To enhance their fracture toughness, computational modeling, as an optimization tool is used to provide guidelines to eliminate crack growth.

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3D Tunable, Multiscale, and Multistable Vibrational Micro‐Platforms Assembled by Compressive Buckling

Cited by 43 publications

References 46 publications

Mechanically Guided Post‐Assembly of 3D Electronic Systems

Mechanically Guided Post‐Assembly of 3D Electronic Systems

Assembly of Advanced Materials into 3D Functional Structures by Methods Inspired by Origami and Kirigami: A Review

Fabrication and Mechanical Cycling of Polymer Microscale Architectures for 3D MEMS Sensors

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