3D Packaging Architectures and Assembly Process Design

Mahajan, Ravi; Sankman, Bob

doi:10.1007/978-3-319-44586-1_2

Cited by 14 publications

(2 citation statements)

References 40 publications

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“…In this paper, using BDS (typically in the range of 10 MHz to 40 GHz), we have studied the oxidation of a copper layer in a purposely built through-silicon via (TSV) enabled 3-D integrated circuit (3D-IC) during cycled high-temperature storage. The devices under test (DUT) were comprised of two-level stacked dies, with a Cu damascene redistribution level (RDL) that allows for circuitry fan-out and lateral communication between the chips, as shown in Figure 1 [5,6]. In this work, we specifically focused on the RDL features.…”

Section: Introductionmentioning

confidence: 99%

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

et al. 2020

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Contactless broadband microwave spectroscopy (a.k.a., broadband dielectric spectroscopy (BDS)) enables the accurate operando analysis of the electrical and magnetic properties without compromising the kinetic conditions of the experiment. The BDS method is sensitive to the actual electronic structure of species, and it is most relevant to redox reactions involving chargetransfer. In this paper, using BDS, we have studied and characterized the oxidation of a copper layer in a purposely built prototypical 3-D integrated circuit (3D-IC) during cycled high-temperature storage. We show that the microwave signal loss in these devices is attributable to the energy dissipation through the signal's interactions with the copper oxidation product. The results demonstrate that contactless BDS could be leveraged into an excellent metrology for applications that use metal oxide as sensing elements.

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Section: Introductionmentioning

confidence: 99%

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

et al. 2020

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“…Hence, more efficient and stable heat dissipation materials are required when electronic devices, especially for power devices, are assembled on substrates. 11,12 Copper (Cu) is an outstanding thermal and electrical conductor and is vastly used in electronic packaging, but it is hard to achieve the anisotropic interconnection due to its isotropic conductivities. Anodized aluminum oxide (AAO) films are aluminum-based materials composing with an individual cylindrical channel array with high hardness, 13 and they are a kind of excellent dielectric materials with dielectric constant ∼4.5 varying from 10 to 20 GHz.…”

Section: Introductionmentioning

confidence: 99%

One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

et al. 2019

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By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO with a pore-filling percentage of 99.4%, as the ion concentration in AAO pores can re-equilibrate to electrolyte concentration during the current-off period. The CuNPA-filled AAO film showed a high thermal conductivity of 153.12 W/(m·K) in the vertical direction and a low thermal conductivity of 3.43 W/(m·K) in the horizontal direction. Hence, the anisotropic ratio of the thermal conductivity reached 44.64. Moreover, the fabrication process was facile and cost-effective, showing a potential application prospect in the field of high-density packages and power electronic devices.

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Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities

Mallik¹,

Mahajan²,

Raravikar³

et al. 2018

Nanopackaging

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3D Packaging Architectures and Assembly Process Design

Cited by 14 publications

References 40 publications

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities

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