Copper nanowire (CuNW) conductors have been considered to have a promising perspective in the area of stretchable electronics due to the low price and high conductivity. However, the fabrication of CuNW conductors suffers from harsh conditions, such as high temperature, reducing atmosphere, and time-consuming transfer step. Here, a simple and rapid one-step photonic sintering technique was developed to fabricate stretchable CuNW conductors on polyurethane (PU) at room temperature in air environment. It was observed that CuNWs were instantaneously deoxidized, welded and simultaneously embedded into the soft surface of PU through the one-step photonic sintering technique, after which highly conductive network and strong adhesion between CuNWs and PU substrates were achieved. The CuNW/PU conductor with sheet resistance of 22.1 Ohm/sq and transmittance of 78% was achieved by the one-step photonic sintering technique within only 20 μs in air. Besides, the CuNW/PU conductor could remain a low sheet resistance even after 1000 cycles of stretching/releasing under 10% strain. Two flexible electronic devices, wearable sensor and glove-shaped heater, were fabricated using the stretchable CuNW/PU conductor, demonstrating that our CuNW/PU conductor could be integrated into various wearable electronic devices for applications in food, clothes, and medical supplies fields.
As
one of the most effective surface-enhanced infrared absorption
(SEIRA) techniques, metal–insulator–metal structured
metamaterial perfect absorbers possess an ultrahigh sensitivity and
selectivity in molecular infrared fingerprint detection. However,
most of the localized electromagnetic fields (i.e., hotspots) are confined in the dielectric layer, hindering
the interaction between analytes and hotspots. By replacing the dielectric
layer with the nanofluidic channel, we develop a sapphire (Al2O3)-based mid-infrared (MIR) hybrid nanofluidic-SEIRA
(HN-SEIRA) platform for liquid sensors with the aid of a low-temperature
interfacial heterogeneous sapphire wafer direct bonding technique.
The robust atomic bonding interface is confirmed by transmission electron
microscope observation. We also establish a design methodology for
the HN-SEIRA sensor using coupled-mode theory to carry out the loss
engineering and experimentally validate its feasibility through the
accurate nanogap control. Thanks to the capillary force, liquid analytes
can be driven into sensing hotspots without external actuation systems.
Besides, we demonstrate an in situ real-time dynamic
monitoring process for the acetone molecular diffusion in deionized
water. A small concentration change of 0.29% is distinguished and
an ultrahigh sensitivity (0.8364 pmol–1 %) is achieved.
With the aid of IR fingerprint absorption, our HN-SEIRA platform brings
the selectivity of liquid molecules with similar refractive indexes.
It also resolves water absorption issues in traditional IR liquid
sensors thanks to the sub-nm long light path. Considering the wide
transparency window of Al2O3 in MIR (up to 5.2
μm), the HN-SEIRA platform covers more IR absorption range for
liquid sensing compared to fused glass commonly used in micro/nanofluidics.
Leveraging the aforementioned advantages, our work provides insights
into developing a MIR real-time liquid sensing platform with intrinsic
IR fingerprint selectivity, label-free ultrahigh sensitivity, and
ultralow analyte volume, demonstrating a way toward quantitative molecule
identification and dynamic analysis for the chemical and biological
reaction processes.
Copper nanowire transparent electrodes have received increasing interest due to the low price and nearly equal electrical conductivity compared with other TEs based on silver nanowires and indium tin oxide (ITO). However, a post-treatment at high temperature in an inert atmosphere or a vacuum environment was necessary to improve the conductivity of Cu NW TEs due to the easy oxidation of copper in air atmosphere, which greatly cancelled out the low price advantage of Cu NWs. Here, a high intensity pulsed light technique was introduced to sinter and simultaneously deoxygenate these Cu NWs into a highly conductive network at room temperature in air. The strong light absorption capacity of Cu NWs enabled the welding of the nanowires at contact spots, as well as the removal of the thin layer of residual organic compounds, oxides and hydroxide of copper even in air. The Cu NW TE with a sheet resistance of 22.9 Ohm sq(-1) and a transparency of 81.8% at 550 nm has been successfully fabricated within only 6 milliseconds exposure treatment, which is superior to other films treated at high temperature in a hydrogen atmosphere. The HIPL process was simple, convenient and fast to fabricate easily oxidized Cu NW TEs in large scale in an air atmosphere, which will largely extend the application of cheap Cu NW TEs.
A new technique of filling friction stir welding (FFSW) relying on a semiconsumable joining tool has been developed to repair the keyhole left at the end of friction stir welding (FSW) seam. The conventional nonconsumable tool of FSW was transformed, and a semiconsumable joining tool consisting of alloy steel shoulder and aluminium alloy joining bit was designed to create a solid state joint. Using the combined plastic deformation and flow of the consumable joining bit and the wall of the keyhole, the FFSW process is able to repair the keyhole with both metallurgical and mechanical bonding characteristics, and the FSW seam can be achieved without keyhole or other defects. The relative tensile strength and elongation of the FFSW joint are 84?3 and 98?9% of the base weld without defects respectively.
This study reports the concept of a water/moisture-induced hygroelectric generator based on the direct contact between magnesium (Mg) alloy and oxidized carbon nanofibers (CNFs). This device generates an open-circuit voltage up to 2.65 V within only 10 ms when the unit is placed in contact with liquid water, which is higher than the reduction potential of magnesium. The average peak short-circuit current density is ∼6 mA/cm 2 , which is among the highest values yet reported for water-induced electricity generators. Our results indicate that galvanic corrosion occurs at the interface between the CNF and Mg electrode, but the device can still generate electricity because of the high contact resistance caused by the work function difference between Mg and CNF and the surface oxidation. The oxidized CNF is shown to absorb water/moisture and get reduced, leading to a capacitive discharging effect to provide enhanced signal amplitude and sensitivity. These devices are found to be highly sensitive to small quantities of water, and their high output voltage and current make them useful for the detection of water vapor in the human breath as well as changes in ambient humidity. The Mg/ CNF systems thus provide a new technology for use in the fabrication of self-powered water/moisture sensors and the development of portable electric power generators.
Silver nanowires (Ag NWs) are key materials to fabricate next-generation flexible transparent electrodes (FTEs). Currently, the applications of Ag NWs are impeded by the large wire−wire contact resistance. Herein, a selflimited nanosoldering method is proposed to reduce the contact resistance by epitaxially depositing silver nanosolders at the Ag NW junctions, which have a negligible effect on the optical transparency, while decreasing the sheet resistance of the Ag NW film from 18.6 to 7.7 Ω/sq at a transmittance of 90%. In addition, the deposited nanosolders at the junctions remarkably improve the electrical and mechanical stabilities of the Ag NW electrodes. Notably, this simple nanosoldering process can be rapidly conducted under room temperature and ambient conditions and is free of any technical support or specific equipment. This technique is easily applied to the nanosoldering of 210 × 297 mm FTEs. Based on these FTEs, a high-performance flexible transparent heater with a sheet resistance 3.7 Ω/sq at a transmittance of 82.5% is constructed. Because of the high heating rate (4.8 °C/s), the heater can produce uniform heating (145 °C) at a short response time (30 s) and low input voltage (6 V).
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