One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

Abstract

By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO with a pore-filling percentage of 99.4%, as the ion concentration in AAO pores can re-equilibrate to electrolyte concentration during the current-off period. The CuNPA-filled AAO film showed a high thermal conductivity of 153.12 W/(m·K) in the vertical direction and a low thermal conductivity of 3.43 W/(m·K) in the horizontal direction. Hence, the anisotropic ratio of the thermal conductivity reached 44.64. Moreover, the fabrication process was facile and cost-effective, showing a potential application prospect in the field of high-density packages and power electronic devices.

WO3-Based Slippery Liquid-Infused Porous Surfaces with Long-Term Stability

“…As a new type of coating strategy for surface modification, SLIPS have received a lot of attention in the past years. A lot of strategies such as ultrashort pulsed laser ablation, chemical vapor deposition, electrospinning, electrochemical deposition, , spin coating, , self-roughened coatings, dip coating, colloidal templating, and layer-by-layer assembly have been developed to prepare porous nanostructures and/or microstructures of the SLIPS. Doll et al synthesized SLIPS with microstructures on the titanium surface by using an ultrashort pulsed laser ablation .…”

Towards Electrochemical Water Desalination Techniques: A Review on Capacitive Deionization, Membrane Capacitive Deionization and Flow Capacitive Deionization

“…Current efficiency in FCDI is practically low in comparison to CDI/MCDI due to the water component (weak electrolyte) of the feed electrode thus impeding fast charge transfer from the current collector to the slurry. This is a major challenge, hence introduction of coupling nano-pillars such as Cu or Ni nano-pillars to graphite current collector could improve contact area and offer good electronic conductivity [120][121][122][123].…”

Highly uniform, straightforward, controllable fabrication of copper nano-objects via artificial nucleation-assisted electrodeposition

“…Unfortunately, the electrodeposition technique with nanoporous templates are still suffering from such a non-uniform electrodeposition behavior among each nanopores or requiring complicated post process consisting of totally removal of the electrically resistive oxide barrier layer at the bottom of each pore and subsequent formation of metallic thin film on the opened bottom for electrical contact for electrodeposition by a vacuum-deposition or others [27][28][29].…”