3D Packaging Architectures and Assembly Process Design

Mahajan, Ravi; Sankman, Bob

doi:10.1007/978-981-15-7090-2_2

Cited by 4 publications

(5 citation statements)

References 47 publications

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“…A similarity between assembly clauses or assembly sequence subgraphs can be predicted using two graph-level representations, G a and G b . p = FEN( g a , g b , g a g b , g a − g b ) (7) where p ∈ [0, 1], the training objective is to minimize the binary cross-entropy loss.…”

Section: • Relational Classifier Modulementioning

confidence: 99%

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A Knowledge Graph-Based Approach for Assembly Sequence Recommendations for Wind Turbines

Liu,

Zhou,

et al. 2023

Machines

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There are various forms of assembly data sources for wind turbines, which contributes to the lack of a unified and standardized expression. Moreover, the reusability of historical assembly data is low, which leads to the poor reasoning ability of a new product assembly sequence. In this paper, we propose a knowledge graph-based approach for assembly sequence recommendations for wind turbines. First, for the multimodal data (text in process manual, image of tooling, and three-dimensional (3D) model) of assembly, a multi-process assembly information representation model is established to express assembly elements in a unified way. In addition, knowledge extraction methods for different modal data are designed to construct a multimodal knowledge graph for wind turbine assembly. Further, the retrieval of similar assembly process items based on the bidirectional encoder representation from transformers joint graph-matching network (BERT-GMN) is proposed to predict the assembly sequence subgraphs. Also, a Semantic Web Rule Language (SWRL)-based assembly process items inference method is proposed to automatically generate subassembly sequences by combining component assembly relationships. Then, a multi-objective sequence optimization algorithm for the final assembly is designed to output the optimal assembly sequences. Finally, taking the VEU-15 wind turbine as the object, the effectiveness of the assembly process information modeling and part multi-source information representation is verified. Sequence recommendation results are better quality compared to traditional assembly sequence planning algorithms. It provides a feasible solution for wind turbine assembly to be optimized from multiple objectives simultaneously.

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Section: • Relational Classifier Modulementioning

confidence: 99%

“…Assembly knowledge is constantly evolving in practice, providing a key reference for the design and manufacturing of complex products [7][8][9]. Manufacturing products are constantly iterated and upgraded.…”

Section: Introductionmentioning

confidence: 99%

A Knowledge Graph-Based Approach for Assembly Sequence Recommendations for Wind Turbines

Liu,

Zhou,

et al. 2023

Machines

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“…In this paper, using BDS (typically in the range of 10 MHz to 40 GHz), we have studied the oxidation of a copper layer in a purposely built through‐silicon via (TSV) enabled 3‐D integrated circuit (3D‐IC) during cycled high‐temperature storage. The devices under test (DUT) were comprised of two‐level stacked dies, with a Cu damascene redistribution level (RDL) that allows for circuitry fan‐out and lateral communication between the chips, as shown in Figure 1 [5, 6]. In this work, we specifically focused on the RDL features.…”

Section: Introductionmentioning

confidence: 99%

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

et al. 2020

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Contactless broadband microwave spectroscopy (a.k.a., broadband dielectric spectroscopy (BDS)) enables the accurate operando analysis of the electrical and magnetic properties without compromising the kinetic conditions of the experiment. The BDS method is sensitive to the actual electronic structure of species, and it is most relevant to redox reactions involving chargetransfer. In this paper, using BDS, we have studied and characterized the oxidation of a copper layer in a purposely built prototypical 3-D integrated circuit (3D-IC) during cycled high-temperature storage. We show that the microwave signal loss in these devices is attributable to the energy dissipation through the signal's interactions with the copper oxidation product. The results demonstrate that contactless BDS could be leveraged into an excellent metrology for applications that use metal oxide as sensing elements.

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“…Hence, more efficient and stable heat dissipation materials are required when electronic devices, especially for power devices, are assembled on substrates. 11,12 Copper (Cu) is an outstanding thermal and electrical conductor and is vastly used in electronic packaging, but it is hard to achieve the anisotropic interconnection due to its isotropic conductivities. Anodized aluminum oxide (AAO) films are aluminum-based materials composing with an individual cylindrical channel array with high hardness, 13 and they are a kind of excellent dielectric materials with dielectric constant ∼4.5 varying from 10 to 20 GHz.…”

Section: ■ Introductionmentioning

confidence: 99%

“…However, thermal conductivity of the adhesive [varying from 3 to 12 W/(m·K)] was far lower than that of metal materials. − To enhance their thermal and electrical performances, fillers such as Ag, Au, and graphene were added into ACA at the expense of high cost and complex fabrication processes. , More essentially, the base materials of ACA were mostly organics and, thus, they were unstable under high temperature, causing mechanical performance degradation over time. Hence, more efficient and stable heat dissipation materials are required when electronic devices, especially for power devices, are assembled on substrates. , Copper (Cu) is an outstanding thermal and electrical conductor and is vastly used in electronic packaging, but it is hard to achieve the anisotropic interconnection due to its isotropic conductivities. Anodized aluminum oxide (AAO) films are aluminum-based materials composing with an individual cylindrical channel array with high hardness, and they are a kind of excellent dielectric materials with dielectric constant ∼4.5 varying from 10 to 20 GHz .…”

Section: Introductionmentioning

confidence: 99%

One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

et al. 2019

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By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO with a pore-filling percentage of 99.4%, as the ion concentration in AAO pores can re-equilibrate to electrolyte concentration during the current-off period. The CuNPA-filled AAO film showed a high thermal conductivity of 153.12 W/(m·K) in the vertical direction and a low thermal conductivity of 3.43 W/(m·K) in the horizontal direction. Hence, the anisotropic ratio of the thermal conductivity reached 44.64. Moreover, the fabrication process was facile and cost-effective, showing a potential application prospect in the field of high-density packages and power electronic devices.

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3D Packaging Architectures and Assembly Process Design

Cited by 4 publications

References 47 publications

A Knowledge Graph-Based Approach for Assembly Sequence Recommendations for Wind Turbines

A Knowledge Graph-Based Approach for Assembly Sequence Recommendations for Wind Turbines

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**

One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

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