3D double sided detector fabrication at IMB-CNM

Pellegrini, G.; Balbuena, J.P.; Bassignana, D.; Cabruja, E.; Fleta, C.; Guardiola, Consuelo; Lozano, M.; Quirion, D.; Ullán, M.

doi:10.1016/j.nima.2012.05.087

Cited by 44 publications

(46 citation statements)

References 7 publications

(6 reference statements)

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“…Columnar 3D pixel sensors [4,5] possess several intrinsic properties making them good candidates to create the layers of Figure 1: Schematic diagram of a planar (left) and a 3D (right) sensor, showing the charge carrier creation when a particle passes through, and the carriers movement before being collected on the electrodes. a tracking system exposed to an extreme radiation environment.…”

Section: Radiation Hardness and 3d Columnar Pixel Sensorsmentioning

confidence: 99%

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Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC

Duarte-Campderros

Currás

Fernández

et al. 2019

Nuclear Instruments and Methods in Physics Research Section A:

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Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about 1 × 10 16 n eq cm −2 (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.

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Section: Radiation Hardness and 3d Columnar Pixel Sensorsmentioning

confidence: 99%

“…Detector and fabrication description can be found on ref. [4,5]. Figure 2 shows both single-sided FBK and double-sided IMB-CNM pixel layout sensors.…”

Section: Radiation Hardness and 3d Columnar Pixel Sensorsmentioning

confidence: 99%

Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC

Duarte-Campderros

Currás

Fernández

et al. 2019

Nuclear Instruments and Methods in Physics Research Section A:

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“…The detectors are fabricated in a similar method as reported in ref. [9] and they will use the mask detailed in ref. [10].…”

Section: Introductionmentioning

confidence: 99%

Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

Baselga

Pellegrini

Quirion

2017

Nuclear Instruments and Methods in Physics Research Section A:

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The LHC is expected to reach luminosities up to 3000 fb −1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the AT-LAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large η angles.

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“…The tight IBL time schedule made evident that the double-sided 3D sensor technologies of FBK [6] and CNM [7] offered a number of advantages, among them reduced process complexity and faster production times compared to the singlesided 3D sensor technology with support wafer originally proposed at SNF (Stanford, USA) [8] and later transferred to SINTEF [9]. Furthermore, with double-sided 3D's the bias can be applied from the sensor back-side, making the front-side layout less demanding and significantly simplifying the sensor assembly within a pixel detector system.…”

Section: Lessons Learned From Existing 3d Detectorsmentioning

confidence: 99%

Small pitch 3D devices

Betta¹,

Mendicino²,

Sultan³

et al. 2017

Proceedings of the 25th International Workshop on Vertex Detectors — PoS(Vertex 2016)

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3D sensors are a promising option for the innermost pixel layers at the High Luminosity LHC. However, the required very high hit-rate capabilities, increased pixel granularity, extreme radiation hardness, and reduced material budget call for a device downscale as compared to existing 3D sensors, involving smaller pitch (e.g., 50×50 or 25×100 µm 2 ), shorter inter-electrode spacing (~30 µm), narrower electrodes (~5 µm), and reduced active thickness (~100 µm). The development of a new generation of 3D pixel sensors with these challenging features is under way by many research groups, in collaboration with processing facilities like FBK, CNM, and SINTEF. This paper talk will review the lessons learned from existing 3D detectors, and will address the main design and technological issues for small pitch 3D devices. Preliminary results from the electrical and functional characterization of the first prototypes will be reported and compared to TCAD simulations.

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3D double sided detector fabrication at IMB-CNM

Cited by 44 publications

References 7 publications

Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC

Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC

Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade

Small pitch 3D devices

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