PostprintThis is the accepted version of a paper published in IEEE Electron Device Letters. This paper has been peer-reviewed but does not include the final publisher proof-corrections or journal pagination.Citation for the original published paper (version of record):Elahipanah, H., Salemi, A., Zetterling, C-M., Östling, M. (2015) 5.8-kV Implantation-Free 4H-SiC BJT With Multiple-Shallow-Trench Junction Termination Extension.
IEEE Electron Device Letters
IndexTerms-4H-SiC, multiple-shallow-trench JTE, implantation-free, high-voltage BJT.