No abstract

Anodic dissolution of natural surface-oxidized, air-annealed, cathodically reduced, and cathodically deposited copper in hydrophobic ionic liquid 1-buthyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide under galvanostatic conditions by means of gravimetric measurements was studied. The resulting samples were mirror-like oxide-free copper pattern. The mechanism of the electropolishing of oxidized copper surface was considered. The consequent anodic reactions Cu2O - 1e = Cu(+) + CuO, CuO - 2e = Cu(2+) + O, and Cu - 1e = Cu(+) take place. The electropolishing itself occurs over oxygen-free copper surface due to competitive residual water discharge in the pits and copper dissolution on the roughness.

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The formation of ordered hexagonal nanostructures with the size of 50−120 nm at the electrode surface has been studied in the course of electrochemical polishing of nickel and steel in the hydrophobic ionic liquid 1-butyl-3-methylimidazolium bis(triflate)imide. Optimal conditions favorable for the formation of such ordered structures have been revealed under the galvanostatic regime (I = 8 mA•cm −2 ; t = 10 min) and potentiostatic mode of operation (E = 3.0−3.2 V; t = 40 min). A theoretical background behind the generation of the hexagonal nanostructures has been proposed.