Surface State of Sacrificial Copper Electrode by Electropolishing in Hydrophobic Ionic Liquid 1-Butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide

Lebedeva, Olga; Dzhungurova, Gilyana; Zakharov, A. N.; Kultin, Dmitry; Kustov, L. М.; Krasovskii, V. G.; Калмыков, К. Б.; Дунаев, С. Ф.

doi:10.1021/am402213r

Cited by 20 publications

(21 citation statements)

References 18 publications

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“…The aluminum oxide film is assumed to produce a dull finish on the metal surface, owing to its considerable thickness (~0.5-1 µm) [13,14]. The light scattering on natural oxidized copper is also due to the oxide film, the thickness of which was calculated to be about 627 nm [15]. The oxide film thicknesses on chromium [16], nickel [17], and titanium [18,19] are considerably smaller (3-7 nm) than the wavelength of visible light.…”

Section: Electropolishing Mechanismsmentioning

confidence: 99%

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

Lebedeva

Kultin

Zakharov

et al. 2021

Metals

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Electropolishing of metal surfaces is a benign alternative to mechanical treatment. Ionic liquids are considered as green electrolytes for the electropolishing of metals. They demonstrate a number of advantages in comparison with acid aqueous solutions and other methods of producing smooth or mirror-like surfaces that are required by diverse applications (medical instruments, special equipment, implants and prostheses, etc.). A wide window of electrochemical stability, recyclability, stability and tunability are just a few benefits provided by ionic liquids in the title application. An overview of the literature data on electropolishing of such metals as Ti, Ni, Pt, Cu, Al, U, Sn, Ag, Nb, stainless steel and other alloys in ionic liquids is presented.

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Section: Electropolishing Mechanismsmentioning

confidence: 99%

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

Lebedeva

Kultin

Zakharov

et al. 2021

Metals

Self Cite

View full text Add to dashboard Cite

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“…These electrolytes provide significant advantages such as high solubility of metal salts, high electrical conductivity and high electrochemical stability, that make them ideal for metal processing. Many studies have been carried out demonstrating the feasibility of using ionic liquids as electrolytes in EP for a variety of different stainless steels, Ni/Co alloys [11], Cu [12] or Ti [13], but there is still work to do with the aim of industrializing this process.…”

Section: Challenges and Opportunities In Next Generation Of Electropomentioning

confidence: 99%

Challenges and opportunities in next generation of electropolishing surfaces

Vara

Butrón

García-Blanco

2015

Surface Engineering

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“…The electrodeposition of copper has been investigated for a variety of applications, and the anodic dissolution of metallic copper has been thoroughly studied in ionic liquid (IL) and deep eutectic solvent (DES) media [1][2][3][4][5][6][7][8][9][10]. Previously, the anodic dissolution of metallic copper has been thoroughly examined in aqueous media [11][12][13]. This invaluable metal has wide applications, including electronics, decorating, pre-coating, and electro-catalysis [14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

The Anodic Behaviour of Bulk Copper in Ethaline and 1-Butyl-3-Methylimidazolium Chloride

et al. 2019

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The anodic dissolution of bulk metallic copper was conducted in ionic liquids (ILs)-a deep eutectic solvent (DES) ((CH 3 ) 3 NC 2 H 4 OH) comprised of a 1:2 molar ratio mixture of choline chloride Cl (ChCl), and ethylene glycol (EG)-and imidazolium-based ILs, such as C 4 mimCl, using electrochemical techniques, such as cyclic voltammetry, anodic linear sweep voltammetry, and chronopotentiometry.To investigate the electrochemical dissolution mechanism, electrochemical impedance spectroscopy (EIS) was used. In addition to spectroscopic techniques, for instance, UV-visible spectroscopy, microscopic techniques, such as atomic force microscopy (AFM), were used. The significant industrial importance of metallic copper has motivated several research groups to deal with such an invaluable metal. It was confirmed that the speciation of dissolved copper from the bulk phase at the interface region is [CuCl 3 ] − and [CuCl 4 ] 2− in such chloride-rich media, and the EG determine the structure of the interfacial region in the electrochemical dissolution process. A super-saturated solution was produced at the electrode/solution interface and CuCl 2 was deposited on the metal surface.Gu et al. studied electrodeposition and the corrosion behaviour of copper in a choline chloride-ethylene glycol DES. In the electrodeposition process, a rough surface was obtained with the addition of ethylene diamine; the corrosion decreased and a relatively uniform surface was gained [5]. Many research groups have tried to deal with the physical properties of ethaline (choline chloride-ethylene glycol). it was found that the mass transport could be increased with an increasing temperature; when the temperature was increased to 50 • C, the viscosity decreased by 65% [7]. Concerning the physical properties of the electrolyte, such as conductivity and viscosity, it was found that it is insensitive to metal-salt addition but strongly temperature dependent [9]. The speciation of copper is well-defined in choline-based DESs. It was determined to be [CuCl 3 ] 2− and [CuCl 4 ] 2− for Cu(I) and Cu(II), respectively [20]. The dissolution of bulk copper was studied previously in these media, in the present work attempt was directed to deal with copper in more detail [21]. Deep eutectic solvents (DESs) are attracting significant research interest as electrochemical media, especially for electrodeposition, as they share many of the useful properties of ILs, but are typically greener and cheaper [22]. The influence of water and the changing potential on the interfacial region between a platinum electrode and a DES were studied. It was found that the nanostructural feature of interface decreased in the presence of small amount of water and was also strongly potential dependent [23].The aim of this work is to investigate the dissolution mechanism of copper in a DES and its comparable IL and compare it to the aqueous system. This is important for counter-electrode processes during electrodeposition, for electropolishing, and also to understand whether metallic co...

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Surface State of Sacrificial Copper Electrode by Electropolishing in Hydrophobic Ionic Liquid 1-Butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide

Cited by 20 publications

References 18 publications

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

Challenges and opportunities in next generation of electropolishing surfaces

The Anodic Behaviour of Bulk Copper in Ethaline and 1-Butyl-3-Methylimidazolium Chloride

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