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In this work, we offered a facile strategy to produce lignin microspheres (LMS) with loading of benzotriazole (BTA) inhibitors, which were released as the pH changed. The morphological and compositional characterizations demonstrated that the BTA inhibitors were efficiently encapsulated in the LMS whose load was up to 15.5 wt %. Tests of crossed scratches of coatings indicated that the LMS@BTA/pure waterborne epoxy resin (WEP) had a good self-healing property. By the electrochemical impedance spectroscopy test, the long-term anticorrosion property of LMS@BTA/WEP composites was 1 order of magnitude higher than that of WEP, which indicated that LMS@BTA greatly improved the corrosion resistance. The highly effective anticorrosion should be attributed to the pH-responsive release behavior of BTA from LMS, which actively protected the steel substrate. The enhanced anticorrosion and the controlled release of BTA enlarged the high value-added applications of lignin.

Constructing a layer-by-layer framework is a highly efficient strategy for preparing thermal management materials with excellent performance. In this report, thermal oxidation and ultrasonic exfoliation of hexagonal boron nitride can prepare hydroxylated boron nitride nanosheet (BNNS-OH). BNNS-OH layer and cellulose nanofiber (CNF) layer are assembled, respectively, on the CNF surface to form a homogeneous film by vacuum-assisted self-assembly and hydrogen bond interaction. With the increase in the number of BNNS-OH layers and CNF layers, the in-plane thermal conductivity of the multilayer film increases dramatically, which is up to 1.47 W•m −1 •K −1 for 0.16 wt % BNNS-OH, and the thermal conductivity efficiency of the unit weight filler is up to 1142%. The multilayer films maintain optical transparency and mechanical property owing to the hierarchical structure and ultralow filler content. This work provides a new method to prepare a good transparent, mechanically and thermally conductive cellulose nanofiber/boron nitride nanosheet multilayer film, which is promising for thermal dissipation in a series of modern devices.

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