Microencapsulated ammonium polyphosphate (MCAPP) with a melamine–formaldehyde (MF) resin coating layer was prepared by in situ polymerization. MCAPP was characterized by Fourier transform infrared, X‐ray photoelectron spectroscopy, and so on. The results show that the microencapsulation with MF resin leads to a decrease in the particles' size and water absorption. The flame retardant action and mechanism of MCAPP and ammonium polyphosphate (APP) in polypropylene are studied using limiting oxygen index (LOI) and UL 94 test, and their thermal stability is evaluated by thermogravimetric analysis. The LOI value of the PP/MCAPP composite at 30 wt% loading is 30.5%, whereas the corresponding value of the PP/APP composite is only 20%. Moreover, the LOI values of the PP/MCAPP/PER composites are higher than the ones of the PP/APP/PER composites. In the UL 94 test, the PP/MCAPP/PER composites with suitable ratios of MCAPP to PER can reach the V‐0 rating, and the best rating of the PP/APP/PER composites is V‐1. V‐1. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers

Microencapsulated ammonium polyphosphate (MCU‐APP) with urea–melamine–formaldehyde (UMF) resin is prepared by in situ polymerization, and is characterized by FTIR and XPS. The microencapsulation of APP with the UMF resin leads to a decrease in the particle's water solubility. The flame retardant actions of MCU‐APP and APP in PP are studied using limiting oxygen index (LOI) and UL‐94 test, and their thermal stability is evaluated by thermogravimetric analysis. It is found that the LOI value of the PP/MCU‐APP composite is higher than the value of the PP/APP composite. In comparison with the PP/MCU‐APP composites, the LOI values of the PP/MCU‐APP/DPER ternary composites at the same additive loading increase, and UL‐94 ratings of most ternary composites are raised to V‐0. The water‐resistant properties of the PP composites containing APP and MCU‐APP are studied. Moreover, the combustion behavior of the PP composites is investigated by the cone calorimeter. Copyright © 2008 John Wiley & Sons, Ltd.

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