Inkjet printing has been considered an available way to achieve large size full-color RGB quantum dots LED display, and the key point is to obtain printed film with uniform and flat surface profile. In this work, mixed solvent of 20 vol % 1,2-dichlorobenzene (oDCB) with cyclohexylbenzene (CHB) was used to dissolve green quantum dots (QDs) with CdSe@ZnS/ZnS core/shell structure. Then, by inkjet printing, a flat dotlike QDs film without the coffee ring was successfully obtained on polyetherimide (PEI)-modified ZnO layer, and the printed dots array exhibited great stability and repeatability. Here, adding oDCB into CHB solutions was used to reduce surface tension, and employing ZnO nanoparticle layer with PEI-modified was used to increase the surface free energy. As a result, a small contact angle is formed, which leads to the enhancement of evaporation rate, and then the coffee ring effect was suppressed. The printed dots with flat surface profile were eventually realized. Moreover, inverted green QD-LEDs with PEI-modified ZnO film as electron transport layer (ETL) and printed green QDs film as emission layer were successfully fabricated. The QD-LEDs exhibited the maximum luminance of 12 000 cd/m and the peak current efficiency of 4.5 cd/A at luminance of 1500 cd/m.

Preventing icing on exposed surfaces is important for life and technology. While suppressing ice nucleation by surface structuring and local confinement is highly desirable and yet to be achieved, a realistic roadmap of icephobicity is to live with ice, but with lowest possible ice adhesion. According to fracture mechanics, the key to lower ice adhesion is to maximize crack driving forces at the ice-substrate interface. Herein, we present a novel integrated macro-crack initiator mechanism combining nano-crack and micro-crack initiators, and demonstrate a new approach to designing super-low ice adhesion surfaces by introducing sub-structures into smooth polydimethylsiloxane coatings. Our design promotes the initiation of macro-cracks and enables the reduction of ice adhesion by at least ∼50% regardless of the curing temperature, weight ratio and size of internal holes, reaching a lowest ice adhesion of 5.7 kPa. The multiscale crack initiator mechanisms provide an unprecedented and versatile strategy towards designing super-low ice adhesion surfaces.

Ice accretion presents a severe risk for human safety. Although great efforts have been made for developing icephobic surfaces (the surface with an ice adhesion strength below 100 kPa), expanding the lifetime of state-of-the-art icephobic surfaces still remains a critical unsolved issue. Herein, a novel icephobic material is designed by integrating an interpenetrating polymer network (IPN) into an autonomous self-healing elastomer, which is applied in anti-icing for enhancing the mechanical durability. The molecular structure, surface morphology, mechanical properties, and durable icephobicity of the material were studied. The creep behaviors of the new icephobic material, which were absent in most relevant studies on self-healing materials, were also investigated in this work. Significantly, the material showed great potentials for anti-icing applications with an ultralow ice adhesion strength of 6.0 ± 0.9 kPa, outperforming many other icephobic surfaces. The material also exhibited an extraordinary durability, showing a very low long-term ice adhesion strength of ∼12.2 kPa after 50 icing/deicing cycles. Most importantly, the material was able to exhibit a self-healing property from mechanical damages in a sufficiently short time, which shed light on the longevity of icephobic surfaces in practical applications.

The mitigation of ice on exposed surfaces is of great importance to many aspects of life. Ice accretion, however, is unavoidable as time elapses and temperature lowers sufficiently. One practical solution is to reduce the ice adhesion strength on a surface to as low as possible, by either decreasing the substrate elastic modulus, lowering surface energy or increasing the length of cracks at the ice-solid interface. Herein, we present a facile preparation of polydimethylsiloxane (PDMS) based sandwich-like sponges with super-low ice adhesion. The weight ratio of the PDMS prepolymer to the curing agent is tuned to a lower surface energy and elastic modulus. The introduction of PDMS sponge structures combined the advantages of both a reduced apparent elastic modulus and most importantly, the macroscopic crack initiators at the ice-solid interface, resulting in dramatic reduction of the ice adhesion strength. Our design of sandwich-like sponges achieved a low ice adhesion strength as low as 0.9 kPa for pure PDMS materials without any additives. The super-low ice adhesion strength remains constant after 25 icing and deicing cycles. We thus provide a new and low-cost approach to realize durable super-low ice adhesion surfaces.

All-solution-processed pure formamidinium-based perovskite light-emitting diodes (PeLEDs) with record performance are successfully realized. It is found that the FAPbBr device is hole dominant. To achieve charge carrier balance, on the anode side, PEDOT:PSS 8000 is employed as the hole injection layer, replacing PEDOT:PSS 4083 to suppress the hole current. On the cathode side, the solution-processed ZnO nanoparticle (NP) is used as the electron injection layer in regular PeLEDs to improve the electron current. With the smallest ZnO NPs (2.9 nm) as electron injection layer (EIL), the solution-processed PeLED exhibits a highest forward viewing power efficiency of 22.3 lm W , a peak current efficiency of 21.3 cd A , and an external quantum efficiency of 4.66%. The maximum brightness reaches a record 1.09 × 10 cd m . A record lifetime T of 436 s is achieved at the initial brightness of 10 000 cd m . Not only do PEDOT:PSS 8000 HIL and ZnO NPs EIL modulate the injected charge carriers to reach charge balance, but also they prevent the exciton quenching at the interface between the charge injection layer and the light emission layer. The subbandgap turn-on voltage is attributed to Auger-assisted energy up-conversion process.

Ice adhesion is mainly dictated by surface properties, and water wettability is frequently correlated with ice adhesion strength. However, these established correlations are limited to high ice adhesion and become invalid when the ice adhesion strength is low. Here we carried out an experimental study to explore the relationships between low ice adhesion strength and room temperature surface properties. A variety of room temperature properties of 22 polymer-based hydrophilic and hydrophobic samples consisting of both low and high ice adhesion surfaces were analysed. The properties investigated include water adhesion force, water wettability, roughness, elastic modulus and hardness. Our results show that low ice adhesion strength does not correlate well with water contact angle and its variants, surface roughness and hardness. Low elastic modulus does not guarantee low ice adhesion, however, surfaces with low ice adhesion always show low elastic modulus. Low ice adhesion (below 60 kPa) of tested surfaces may be determinative of small water adhesion force (from 180 to 270 μN). Therefore, measurement of water adhesion force may provide an effective strategy for screening anti-icing or icephobic surfaces, and surfaces within specific values of water adhesion force will possibly lead to a low ice adhesion.

In all-solution processed inverted quantum dots based light emitting diodes (QLEDs), the solvent erosion on the quantum dot (QD) layer prevents devices from reaching high performance. By employing an orthogonal solvent 1,4-dioxane for the hole transport layer (HTL) poly(9-vinlycarbazole) (PVK), the external quantum efficiencies (EQE) of red QLED is increased 4-fold, while the luminous efficiencies (LE) of blue QLED is enhanced by 25 times, compared to the previous devices' record. To further improve the device efficiency and reduce the efficiency roll-off, solution processed PVK/poly [(9,9-dioctylfluorenyl-2,7-diyl)-co-(4,4'-(N-(p-butylphenyl))diphenylamine)] (TFB) double-layer HTL is introduced to facilitate hole injection with stepwise energy level. By reducing the hole injection barrier, the turn-on voltage of QLEDs decreases from 3.4 to 2.7 V for red, from 5.1 to 2.7 V for green, and from 5.3 to 4.1 V for blue. The peak LE reach 22.1 cd/A, 21.4 cd/A, and 1.99 cd/A, while the maximum EQE reach 12.7%, 5.29%, and 5.99%, for red, green, and blue QLEDs, respectively. To the best of our knowledge, the red and blue QLEDs exhibit the best device performance among all the all-solution processed inverted QLEDs. In addition, the blue QLED is the champion among all the inverted QLEDs, including the devices fabricated by thermal evaporation.

Solution-processed electroluminescent tandem white quantum-dot light-emitting diodes (TWQLEDs) have the advantages of being low-cost and high-efficiency and having a wide color gamut combined with color filters, making this a promising backlight technology for high-resolution displays. However, TWQLEDs are rarely reported due to the challenge of designing device structures and the deterioration of film morphology with component layers that can be deposited from solutions. Here, we report an interconnecting layer with the optical, electrical, and mechanical properties required for fully solution-processed TWQLED. The optimized TWQLEDs exhibit a state-of-the-art current efficiency as high as 60.4 cd/A and an extremely high external quantum efficiency of 27.3% at a luminance of 100 000 cd/m. A high color gamut of 124% NTSC 1931 standard can be achieved when combined with commercial color filters. These results represent the highest performance for solution-processed WQLEDs, unlocking the great application potential of TWQLEDs as backlights for new-generation displays.