A method including a polynomial fitting step was proposed for crystallization interface correction of Czochralski crystal growth simulation, which can obtain an axisymmetric interface under a non-axisymmetric flow when the crystal rotates.
Due to the high magnetic field intensity during industrial 300 mm silicon crystal growth, typically up to 0.3 T, the crystal's rotation under this transverse magnetic field (TMF) induces a current that is strong enough to impact both the melt flow and the melt/crystal interface (m/c interface) shape. This paper investigates the influence of TMF-induced current in crystals on the melt flow, temperature distribution, and interface shape through the conduction of three sets of 3D simulations that vary in the electrical conductivity of crystals, TMF intensities, and crystal rotation rates. Combined with experiments, the accuracy of the model has been validated, and a reasonable electrical conductivity of the crystal has been predicted. The study findings reveal a shift in the driving force of forced convection from centrifugal to Lorentz force when the induced current in crystal is augmented. This alteration affects the melt flow and the m/c interface shape. Notably, this study serves as a significant complement to the conventional model, which overlooks the induced current in crystals, enhancing the accuracy and comprehensiveness of the simulation outcomes to provide a robust theoretical underpinning for industrial production.
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