With two-temperature ions in dusty plasma, the effects of variable dust charge on small-amplitude dust-acoustic solitons and large-amplitude dust-acoustic solitary waves are investigated. It is found that both compressive and rarefactive solitons (and solitary waves), as well as double layers, exist. The introduced small, but finite, number density of the lower temperature ions provides the possibility of the coexistence of large-amplitude rarefactive with compressive dust-density solitary waves. The amplitudes of those dust-density solitary waves become smaller and the regime of Mach number is extended wider for the variable dust charge situation compared to the constant dust charge situation.

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Abstract-From cell phones to biomedical systems, modern life is inexorably dependent on the complex convergence of technologies into stand-alone products designed to provide a complete solution in small, highly integrated systems with computing, communication, biomedical and consumer functions. The concept of system-on-package (SOP) originated in the mid-1990s at the NSF-funded Packaging Research Center at the Georgia Institute of Technology. This can be thought of as a conceptual paradigm in which the package, and not the bulky board, as the system and the package provides all the system functions in one single module, not as an assemblage of discrete components to be connected together, but as a continuous merging of various integrated thin film technologies in a small package. In the SOP concept, this is accomplished by codesign and fabrication of digital, optical, RF and sensor functions in both IC and the package, thus distinguishing between what function is accomplished best at IC level and at package level. In this paradigm, IC's are viewed as being best for transistor density while the package is viewed as being best for RF, optical and certain digital-function integration. The SOP concept is demonstrated for a conceptual broad-band system called an intelligent network communicator (INC). Its testbed acts as both a leading-edge research and teaching platform in which students, faculty, research scientists, and member companies evaluate the validity of SOP technology from design to fabrication to integration, test, cost and reliability. The testbed explores optical bit stream switching up to 100 GHz, digital signals up to 5-20 GHz, decoupling capacitor integration concepts to reduce simultaneous switching noise of power beyond 100 W/chip, design, modeling and fabrication of embedded components for RF, microwave, and millimeter wave applications up to 60 GHz. This article reviews a number of SOP technologies which have been developed and integrated into SOP test bed. These are 1) convergent SOP-based INC system design and architecture, 2) digital SOP and its fabrication for signal and power integrity, 3) optical SOP fabrication with embedded actives and passives, 4) RF SOP for high Q-embedded inductors, filters and other RF components, 5) mixed signal electrical test, 6) mixed signal reliability, and 7) demonstration of SOP by INC prototype system.

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A detailed survey of erosion and deposition on plasma-facing components was performed in the TEXTOR tokamak. Co-deposits and dust particles were collected from graphite limiters and from several locations on the Inconel liner. The total amount of dust (loose material), originating mainly from carbon-rich co-deposits detached from the limiters and the liner, was around 2 g, with sizes from 0.1 µm to 1 mm. The morphology and fuel retention was determined using microscopy methods, ion beam analysis and thermal desorption spectrometry. The study revealed differences in structure and fuel content between deposits from the toroidal and main poloidal limiters. There were also splashes, up to 1 mm in diameter, of molten metal (mainly nickel) on the toroidal limiters. Issues of the dust conversion factor (erosion-to-dust) are addressed and a comparison with results of previous dust surveys at TEXTOR is also briefly presented.

In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.Index Terms-optical interconnections, optical planar waveguides.

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