Recently, progress of semiconductor packaging is drastic and multi-pinned devices such as Fan-out Wafer Level Packages (FOWLPs) attract much attention. For those applications, photosensitive polyimides (PSPIs) are applied as redistribution layers (RDLs) and they are required to have high level of properties such as adhesion to metal and reliability. We developed novel low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongation, strong adhesion to the copper RDLs, and high chemical resistance for establishing the multi RDLs by improving the base-polyimides and incorporating polyimides with cross-linkers and adhesion promoters.
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