Fabrication of Redistribution Structure Using Highly Reliable Photosensitive Polyimide for Fan Out Panel Level Packages

Araki, Hitoshi; Shoji, Yu; Masuda, Yuki; Hashimoto, Keika; Matsumura, Kazuyuki; Koyama, Yutaro; Tomikawa, Masao

doi:10.23919/iwlpc.2018.8573286

Cited by 8 publications

(2 citation statements)

References 3 publications

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“…Different dopants and preparation procedures will result in different Dk values for Polyimide. As listed in Table 1 , the Dk value of Polyimide is generally distributed within 2.2 to 3.2 [ 21 , 22 , 23 , 24 , 25 ]. In the experiment of this paper, when the accuracy is set to 0.1, the Dk value retrieved by the algorithm is distributed within the range of 2.680 to 4.500, which proves the reliability of the range retrieval algorithm and the initial range suitable for iterative inversion is determined.…”

Section: Methodsmentioning

confidence: 99%

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

et al. 2022

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High-speed digital microsystems has emerged as one of the most important solutions for improving system performance, bandwidth, and power consumption. Based on mature micro-system processing technology, a material extraction approach for silicon interposer applied for high-speed digital microsystems was presented in order to obtain frequency-dependent precise material parameters. By combining microwave theory and mathematical model of iterative algorithm, the dielectric constant (Dk) and the dissipation factor (Df) of polyimide dielectric layer is acquired, which minimizes testing costs and streamlines testing process. The method is based on two-port transmission/reflection measurements. Vector Network Analyzer (VNA) is used to extract the scattering parameters with an extraction range of 1 MHz to 10 GHz. The algorithm is programmed using MATLAB. The observed Dk values at 2 GHz, 6 GHz, 8 GHz, and 10 GHz are, respectively, 3.22, 3.04, 2.96, 3.03, and 2.91, while the corresponding Df values are 0.021, 0.025, 0.026, 0.026, and 0.024. Finally, the complex permittivity derived is simulated and analyzed using Ansys HFSS. The results verify the validity of the theoretical method and proves that the values of the complex permittivity obtained by the method in this paper are reliable.

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Section: Methodsmentioning

confidence: 99%

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

et al. 2022

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“…In microsystem applications, polyimides are being used in the form of sheets, as substrates, and as thin films. For example, thin polyimide films are employed as stress‐distribution layers, [ 11 ] and dielectric interlayers [ 12 ] in electronics and microsystems. The thin polyimide films are typically realized by spin‐coating a soluble polyimide precursor on a silicon or glass substrate.…”

Section: Introductionmentioning

confidence: 99%

3D Printing by Two‐Photon Polymerization of Polyimide Objects and Demonstration of a 3D‐printed Micro‐Hotplate

Pagliano

Schröder

Stemme

et al. 2023

Adv Materials Technologies

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Polyimides are polymeric materials with outstanding thermal, chemical, and mechanical properties. For this reason, they find applications in several engineering sectors, including aerospace, microsystems, and biomedical applications. For realizing 3D structures made of polyimides, 3D printing is an attractive technique because it overcomes the limitations of polyimide processing using conventional manufacturing techniques such as molding and subtractive manufacturing. However, current polyimide 3D printing approaches are limited to realizing objects with the smallest dimensions of the order of a few hundred micrometers. 3D printing of polyimide objects featuring sub‐micrometer resolution using two‐photon polymerization by direct laser writing is demonstrated here. A negative photosensitive polyimide is applied that is widely used in microsystems applications. To demonstrate the utility of this polyimide 3D printing approach and the compatibility of the 3D objects with operation at elevated temperatures, a micro‐hotplate is 3D printed and characterized at operating temperatures of above 300 °C.

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Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Reliability

Koyama

Shoji

Hashimoto

et al. 2019

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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Fabrication of Redistribution Structure Using Highly Reliable Photosensitive Polyimide for Fan Out Panel Level Packages

Cited by 8 publications

References 3 publications

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

3D Printing by Two‐Photon Polymerization of Polyimide Objects and Demonstration of a 3D‐printed Micro‐Hotplate

Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Reliability

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