Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Reliability

Koyama, Yutaro; Shoji, Yu; Hashimoto, Keika; Masuda, Yuki; Araki, Hitoshi; Tomikawa, Masao

doi:10.1109/ectc.2019.00060

Cited by 10 publications

(2 citation statements)

References 4 publications

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“…Notably, PSPI involves photopatternable PI with photoactive agents and photopatternable PI precursors, such as poly(amic acid) (PAA) or poly(amic ester) (PAE) with photosensitive compounds 85 . The PSPI films are selectively exposed to UV light with a mask, allowing the exposed area to undergo a chemical change, such as cross-linking (negative tone) [86][87][88][89][90][91] and chain scission (positive tone) [92][93][94][95][96][97][98] ; undesired areas are dissolved in the developing solution. Methods for incorporating a wide variety of photochemistries into PI systems has been previously reviewed 84,85,99 .…”

Section: Photo Patterningmentioning

confidence: 99%

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Dong

Shen

et al. 2023

Microsyst Nanoeng

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Polyimides are widely used in the MEMS and flexible electronics fields due to their combined physicochemical properties, including high thermal stability, mechanical strength, and chemical resistance values. In the past decade, rapid progress has been made in the microfabrication of polyimides. However, enabling technologies, such as laser-induced graphene on polyimide, photosensitive polyimide micropatterning, and 3D polyimide microstructure assembly, have not been reviewed from the perspective of polyimide microfabrication. The aims of this review are to systematically discuss polyimide microfabrication techniques, which cover film formation, material conversion, micropatterning, 3D microfabrication, and their applications. With an emphasis on polyimide-based flexible MEMS devices, we discuss the remaining technological challenges in polyimide fabrication and possible technological innovations in this field.

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Section: Photo Patterningmentioning

confidence: 99%

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Dong

Shen

et al. 2023

Microsyst Nanoeng

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“…Therefore, it is thought that the supply of copper into the interface can't catch up with the supply of copper ions into the RDL materials, and voids are generated. [9] 3.6. Effect of copper oxide after the oxygen reflow process…”

Section: Continuity Test After Reliability Processmentioning

confidence: 99%

Reliability Study for Photosensitive RDL Material

Shiraishi,

Takahashi,

Kawasaki

2023

J. Photopol. Sci. Technol.

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In recent years, as electronic devices such as smartphones become more functional, more compact, and lower cost, many semiconductor makers are studying the packages such as WLP (Wafer Level Package) having re-distribution layer (RDL). With the miniaturization and the increase in the number of pins of a semiconductor package, the method of conduction between a semiconductor chip and an external electrode has been changed from wire connection to bump connection and RDL. And the application of a wafer coating material is also required to have higher functions from a buffer coat film to bump protection and an interlayer insulating film for RDL. Further, in recent years, in addition to the purpose of avoiding the performance deterioration of the semiconductor device due to the hightemperature treatment, a packaging material having low heat resistance is sometimes used in the FOWLP, and therefore, the wafer coating material is required to lower temperature curable. We have studied the reliability of the RDL package with various RDL photosensitive materials.

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Synthesis and lithographic properties of positive-tone poly(benzoxazole)s by the effect of amine end-cappers

Shin

Park

Chae

et al. 2023

Molecular Crystals and Liquid Crystals

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Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Reliability

Cited by 10 publications

References 4 publications

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Reliability Study for Photosensitive RDL Material

Synthesis and lithographic properties of positive-tone poly(benzoxazole)s by the effect of amine end-cappers

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