Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation

Shoji, Yu; Masuda, Yuki; Hashimoto, Keika; Isobe, Kimio; Koyama, Yutaro; Okuda, Ryoji

doi:10.1109/ectc.2016.149

Cited by 9 publications

(3 citation statements)

References 5 publications

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“…However, knowledge of thermal stability for advanced packaging is lacking. Considering low-k materials, PSPI has very low electrical conductivity and has previously been studied [34]. However, the study of the diffusion of Cu migration in the low-k materials has not been depicted in the literature.…”

Section: Introductionmentioning

confidence: 99%

Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Ustad,

Chavan,

Kim

et al. 2023

Nanomaterials

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Photosensitive polyimides (PSPIs) have been widely developed in microelectronics, which is due to their excellent thermal properties and reasonable dielectric properties and can be directly patterned to simplify the processing steps. In this study, 3 μm~7 μm thick PSPI films were deposited on different substrates, including Si, 50 nm SiN, 50 nm SiO2, 100 nm Cu, and 100 nm Al, for the optimization of the process of integration with Cu films. In situ temperature-dependent resistance measurements were conducted by using a four-point probe system to study the changes in resistance of the 70 nm thick Cu films on different dielectrics with thick diffusion films of 30 nm Mn, Co, and W films in a N2 ambient. The lowest possible change in thickness due to annealing at the higher temperature ranges of 325 °C to 375 °C is displayed, which suggests the high stability of PSPI. The PSPI films show good adhesion with each Cu diffusion barrier up to 350 °C, and we believe that this will be helpful for new packaging applications, such as a 3D IC with a Cu interconnect.

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Section: Introductionmentioning

confidence: 99%

Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Ustad,

Chavan,

Kim

et al. 2023

Nanomaterials

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“…In order to achieve the requirements, polyimide (PI) or polybenzoxazole (PBO) have been developed [1,2]. They have excellent reliability, but residual stress is necessary to be lowered and resolution is necessary to be improved.…”

Section: Introductionmentioning

confidence: 99%

Low Temperature Curable Photosensitive Dielectric Material with High Resolution

Kimura

Aoki

Lee

et al. 2017

J. Photopol. Sci. Technol.

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Recently, semiconductor package with redistribution layer (RDL), such as fan-out wafer level package (FOWLP), has been developed to achieve downsizing for increasing pin counts and lowering cost. Dielectric material used for FOWLP needs to meet requirements such as low warpage, high reliability and adhesion strength with metals used as RDL. We developed low-temperature curable positive tone dielectric material, AH series, for FOWLP. AH-3000 has low residual stress to suppress substrate warpage, as well as high tensile strength and low CTE for more reliable FOWLP.

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“…However, there are several disadvantages such as thermal damage of device and wafer warpage with typical PI and PBO which need to be cured at high temperature. Low temperature curable PI and PBO have been developed to satisfy the requirements from recent packages [2,3].…”

Section: Introductionmentioning

confidence: 99%

Development of Positive-tone Photodefinable Material for Redistribution Layer

Tanimoto

Aoki

Kimura

et al. 2017

J. Photopol. Sci. Technol.

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Recently semiconductor packages with redistribution layers are gathering attention because of its electrical performance and low energy consumption. Dielectric materials for these packages require low-temperature curability to avoid thermal damage of devices and thermally unstable materials in the packages. Low-temperature curable positive-tone photodefinable material AH-3000 was developed and its reliabilities were evaluated. AH-3000 kept good mechanical properties after reliability test. AH-3000 is also applicable to slit coating, which is required for next-generation panel level package.

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Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation

Cited by 9 publications

References 5 publications

Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Low Temperature Curable Photosensitive Dielectric Material with High Resolution

Development of Positive-tone Photodefinable Material for Redistribution Layer

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