Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Shoji, Yu; Koyama, Yutaro; Masuda, Yuki; Hashimoto, Keika; Isobe, Kimio; Okuda, Ryoji

doi:10.2494/photopolymer.29.277

Cited by 8 publications

(7 citation statements)

References 5 publications

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“…In addition, the polyimide shows good adhesion properties to Cu [4]. We examined the adhesion between copper and the polyimide by a previous report [4]. In the previous work, we found that oxygen permeation in the polyimide film proceeds the Cu oxidation to decrease the adhesion strength.…”

Section: Polyimide Formationmentioning

confidence: 91%

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Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide

Masuda

Hashimoto

Shoji

et al. 2018

J. Photopol. Sci. Technol.

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We successfully developed redistribution structure by using photosensitive polyimide and all wet Cu plating processes. To obtain the structure, patterned Cu was obtained by nonelectrical plating on photosensitive polyimide layer with a mask of photo-resist. Various types of surface treatments on polyimide layer were investigated to obtain good adhesion between Cu and polyimide. In this work, we coated the photosensitive polyimide by a slit coater and found a suitable wet surface treatment to obtain good adhesion to plated Cu. The all wet Cu processes are composed of wet activation process and electro-Cu plating process. By combining all these processes, 40µm line and space Cu pattern was obtained by using a 500-600 mm glass panel. In addition, 2µm line and space Cu pattern was obtained on an 8 inch glass wafer.

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Section: Polyimide Formationmentioning

confidence: 91%

“…The LT-S8001 is low temperature curable photosensitive polyimide having 3-m resolution at 7-m thickness. In addition, the polyimide shows good adhesion properties to Cu [4]. We examined the adhesion between copper and the polyimide by a previous report [4].…”

Section: Polyimide Formationmentioning

confidence: 98%

Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide

Masuda

Hashimoto

Shoji

et al. 2018

J. Photopol. Sci. Technol.

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“…Various studies have been conducted for low temperature curing. In order to perform imide ring closure at a low temperature, a thermobase generator is added [49], and an pre-imidized polymer is used [47]. In addition, focusing on the main chain structure of polyimide, Sasaki reported that the imidization rate determined by the acidity of the diamine component.…”

Section: Low Temperature Curable Photosensitive Polyimidementioning

confidence: 99%

Polyimides for Micro-electronics Applications

Tomikawa¹

2022

Polyimides

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Polyimide is an organic polymer that exhibits the highest level of heat resistance, exhibits excellent mechanical properties and electrical insulation, and is stable for a long period of time. In addition, since it is easy to obtain polymers with different physical characteristics by changing the combination of monomers, it is possible to obtain the desired properties according to the application, and it is used in a wide range of fields such as insulating protective films for semiconductors and electronic components. This chapter describes polyimides used in microelectronics applications such as semiconductors, electronic components, displays, image sensors, and lithium-ion secondary batteries. The development of practical aspects such as photosensitivity, low-temperature curability, and adhesion to copper when used in microelectronics will be described.

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“…In the case of photosensitive dielectrics for fan-out wafer level packaging (FO-WLP), which is focused mainly on form factor and heterogeneous integration, low temperature curable materials below 200 º C are required to reduce warpage of the re-constituted wafer and minimize thermal damage on the embedded ICs [11][12][13][14][15][16]. In addition, higher resolution especially for via openings is also needed to meet future design rules for FO-WLP.…”

Section: Introductionmentioning

confidence: 99%

Next Generation Photosensitive Dielectric Materials for Advanced Packaging Applications

Motobe

Oh‐e

Yamazaki

et al. 2018

J. Photopol. Sci. Technol.

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Hitachi Chemical DuPont MicroSystems (HDMS) is a supplier of photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in Fan-in or Fan-out wafer level packages. These materials offer an easy manufacturing process as well as ensuring high reliability in semiconductor packages. Recently, design rules and structures for next generation packages are advancing in order to achieve higher end multi-functionality. In accordance with this trend, next generation PIs and PBOs need to be developed to address new challenges that include lithographic properties, in-process compatibility and end-use properties and, in this paper, the latest material sets developed by HDMS will be introduced for advanced packaging applications. The 1 st material set is a low stress photosensitive PI designed especially as a protection layer in advanced process node semiconductor ICs where warpage reduction and better protection capability for fragile low-k layers are needed. The 2 nd and 3 rd material sets are designed as low temperature curable photosensitive PI and PBO for use as dielectrics in Fan-out wafer level package to provide good applicability with future device designs as well as high package reliability by improving resolution, cured film properties, adhesion, insulation reliability, and others.

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Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Cited by 8 publications

References 5 publications

Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide

Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide

Polyimides for Micro-electronics Applications

Next Generation Photosensitive Dielectric Materials for Advanced Packaging Applications

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