Next Generation Photosensitive Dielectric Materials for Advanced Packaging Applications

Abstract

Hitachi Chemical DuPont MicroSystems (HDMS) is a supplier of photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in Fan-in or Fan-out wafer level packages. These materials offer an easy manufacturing process as well as ensuring high reliability in semiconductor packages. Recently, design rules and structures for next generation packages are advancing in order to achieve higher end multi-functionality. In accordance with this trend, next generation PIs and PBOs need to be developed to address new challenges that include lithographic properties, in-process compatibility and end-use properties and, in this paper, the latest material sets developed by HDMS will be introduced for advanced packaging applications. The 1 st material set is a low stress photosensitive PI designed especially as a protection layer in advanced process node semiconductor ICs where warpage reduction and better protection capability for fragile low-k layers are needed. The 2 nd and 3 rd material sets are designed as low temperature curable photosensitive PI and PBO for use as dielectrics in Fan-out wafer level package to provide good applicability with future device designs as well as high package reliability by improving resolution, cured film properties, adhesion, insulation reliability, and others.

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

“…Hence, photosensitive organic materials with low residual stress have been developed as interlayer dielectrics for semiconductor devices [2][3][4][5][6][7][8][9][10][11][12][13][14][15]. Recently, Shoji et al had reported that a photosensitive preimidized polyimide (PI) with low residual stress is developed by introducing special soft segment and utilizing low temperature curable crosslinker [2].…”

Recent Trend of Advanced LSI Packaging: Introduction for application of polymers

“…7 also shows applicable photosensitive materials for fabrication in PoP packages.Photosensitive materials include resists used in LSI manufacturing, bump forming resists, insulating materials for RDL (Redistribution Layers), and photosensitive films for Cu plating. Photosensitive insulating materials for RDL have been reported from several companies[11][12][13][14]. Polymer-related materials include a film for release layer acting temporary adhesive, encapsulant materials, die bonding film etc.…”