In recent year, with the development of high traces density and circuit designed at high speed, signal integrity and power integrity generally paid close attention to by everybody. But up till now, there are not complete design theorems for power integrity to support the design of the high frequency and high speed system yet, especially in the design topic of System-inPackage.In this special topic, some well know electromagnetic band-gap (EBG) structures are performed on FR4 2 layer substrate in 40x40mm size, and depredate by plating through via (PTH) to simulate effect reducing of EBG structures applied in SiP. Another, decoupling capacitors are applied on these structures for lower frequency SSN reducing. We hope to find broadband power integrity solutions by decoupling capacitors and EBG structures for system-in package substrate design.
IntroductionIn high-speed digital circuits with increasing operating frequency and decreasing working voltage, a sudden current change incurred by active devices on printed circuit board (PCB) will cause the high frequency voltage to fluctuate. The fluctuating voltage, commonly known as the ground bounce noise or simultaneous switching noise (SSN), will propagate between the power and ground planes. The noise reaches the plane edges and is reflected back into the effective resonant cavity formed by the parallel-plate structure of the power and ground planes. This resonant behavior of the simultaneous switching noise induces many signal integrity and power integrity problems and even electromagnetic radiation. Therefore, accurate modeling and analysis of power/ground planes has become more and more important for maintaining signal integrity and power integrity in printed circuit boards and packages.Through this study, we want that the discussion of practical use in packaging electromagnetic band-gap facing problems; path for IC heat dissipation (thermal/ground vias) and the signal line of vias, which may cause the electromagnetic band-gap failure, for different types of structure may have different effects; we hope for several has been published by the EBG structure to conduct experiments and validation, discuss the different damage on the influence of the EBG electrical properties to enhance the utilization of EBG structures in packaging specifications and capabilities.
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