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In this study, we designed a dual-chirality hierarchical structure to achieve a synergistically enhanced effect in microwave absorption via the hybridization of nanomaterials. Herein, polyaniline (PANi) nanorods with tunable chirality are grown on helical carbon nanotubes (HCNTs), a typical nanoscale chiral structure, through in situ polymerization. The experimental results show that the hierarchical hybrids (PANi@HCNTs) exhibit distinctly dual chirality and a significant enhancement in electromagnetic (EM) losses compared to those of either pure PANi or HCNTs. The maximum reflection loss of the as-prepared hybrids can reach -32.5 dB at 8.9 GHz. Further analysis demonstrates that combinations of chiral acid-doped PANi and coiled HCNTs with molecular and nanoscale chirality lead to synergistic effects resulting from the dual chirality. The so-called cross-polarization may result in additional interactions with induced EM waves in addition to multiscaled relaxations from functional groups and interfacial polarizations, which can benefit EM absorption.

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An intercalation polymerization is applied to regulate the hybridizing structures of polyaniline@graphene (PANI@GE). Polarization of GE sheets is realized, which is attributed to the hybridization by the in situ intercalation-polymerized PANI molecules. The polarizing effect on GE is confirmed by characterizations and density functional theory calculations, and the results indicate that distinct p−π and π–π interactions exist between the PANI molecules and the GE sheets. As a result, this new structural hybrid leads to a high performance of microwave absorption. The minimum reflection loss (RL) of the optimized PANI@GE hybrid can be as low as −64.3 dB at 10.1 GHz with the RL bandwidth of −10 dB being 5.1 GHz (from 8.6 to 13.7 GHz). A further study reveals a special mechanism for the electromagnetic energy consumptions by the structural resonance of the polarized GE-based hybrids, a complex macromolecule. In addition, the fully separated GE provides a good impedance matching, together with the widely held multiscaled relaxations of the interfacial polarization.

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Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.