Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

Guo, Yifan; Lim, C. K.; Chen, W. T.; Woychik, Charles G.

doi:10.1147/rd.375.0635

Cited by 108 publications

(38 citation statements)

References 6 publications

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“…The MATLAB® code follows the idea in CWT section introduced before without invoking MATLAB Wavelet Toolbox®. The final step is to subtract the computed field at PT-1 from the one at PT-2 and use equation (5) to calculate the strain difference between two points. Only Δɛ x , Δɛ y are calculated based on U, V field information at this time [shown in Fig.…”

Section: Resultsmentioning

confidence: 99%

“…In order to process 2D image, a row-by-row or columnby-column scanning order is applied to transform 2D problem into 1D domain. This decomposition is possible due to equation (5).…”

Section: Continuous Wavelet Transform (Cwt)mentioning

confidence: 99%

“…Many theories are proposed but only few accurate experimental methods exist for both verification and providing insight into the failure process. In these experiment methods, Moiré interferometry (MI), which was developed in early 1980, has been demonstrated as an accurate method to measure strain field quantitatively [1][2][3][4][5][6][7]. MI can provide full field interferograms that can be interpreted as the contour map of the displacement on the observation surface plane using fringe-based method and give full field in-plane strain tensor based on the relationship between strain and displacement.…”

Section: Introductionmentioning

confidence: 99%

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Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution

Chen

Basaran

2008

Exp Mech

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Moiré Interferometry (MI) theoretically can provide real-time full strain field measurements in dynamic environment. So it's extensively used in reliability analysis of electronic packaging. Due to the nature of specimen preparations procedure, the optical noise is usually too strong so that an accurate phase-based information processing is not possible. In this paper, a 164 nm/pixel spatial resolution Moiré Interferometer with automated full strain field calculation is proposed. Provided by two-level zooming system, the high spatial resolution increase the signal intensity and eliminate some optical noise which allows accurate full strain field map generated automatically by the combination of phase shifting technique and continuous wavelet transform (CWT). Furthermore, the calculation procedure of CWT proposed here does not require unwrapping and differentiation, which avoid the possible numerical noise introduced in these two steps. In the proposed system, pixel by pixel in-plane strain tensors will be calculate from the intensity map of interferograms using phase-based method. The resulting strain tensor can be used to model constitutive relationship or compare with finite element analysis results. A thermal experiment on BGA packaging is used to demonstrate the advantages of the proposed new design.

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Section: Resultsmentioning

confidence: 99%

“…In order to process 2D image, a row-by-row or columnby-column scanning order is applied to transform 2D problem into 1D domain. This decomposition is possible due to equation (5).…”

Section: Continuous Wavelet Transform (Cwt)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution

Chen

Basaran

2008

Exp Mech

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“…A combination of creep deformation behavior of the solder joints at a high temperature and for a long duration has not been performed and should therefore be studied. Laser moiré interferometry is a relatively new technique and has been used to find the in-plane deformation in microelectronic packages when subjected to thermal [4], mechanical [5], vibration [6] and electrical power loading [7]. A sensitivity as low as 417 nm/fringe order can be achieved by this method.…”

Section: Nomenclaturementioning

confidence: 99%

“…The normal strains in a solder joint is related to the difference in the warpage of the ceramic substrate and the PWB board at the region of the solder joint. The nature of the normal strains in the solder joint when cooled from higher temperature to lower temperature has been studied by Guo et al [4]. They have shown that the normal strains in the vertical direction tend to be compressive at the center and gradually become less and less compressive for the solder joints away from the center.…”

Section: Variation Of Shear Strains With Time During 100°c Dwellmentioning

confidence: 99%

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Tunga

Sitaraman

2008

Exp Mech

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There is a compelling need to experimentally understand solder joint deformation behavior at high temperatures over an extended period of time. Accordingly, the deformation behavior of solder joints in a Ceramic Ball Grid Array (CBGA) package mounted on an organic FR4 board under extended dwell time at a high temperature has been studied using laser moiré interferometry. The warpage and the in-plane horizontal deformation of the ceramic substrate and the organic board as a function of time were determined. The variation of the normal strains and shear strains in the solder joints with time were also investigated. It was found that increased sensitivity was necessary to accurately determine the strains in the small sized solder joints. A new method utilizing carrier fringes to increase the sensitivity of the moiré interferometry system is proposed and has been used to determine the strains in the small sized solder joints. Increased sensitivity can be obtained merely by changing the incident angle of the laser light on the surface of the specimen, thereby making it unnecessary to use expensive phase shifting apparatus with the traditional laser moiré system.

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Modeling Validation Tools

Liu

2011

Modeling and Simulation for Microelectronic Packaging Assembly

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Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

Cited by 108 publications

References 6 publications

Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution

Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Modeling Validation Tools

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