Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

Abstract

Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

Interfacial behavior of a flip-chip structure under thermal testing

“…Therefore, advanced experimental techniques are in high demand to provide accurate solutions for deformation studies of microelectronics devices [18]. Validation of numerical models generated by the finite element method is achieved through experimental measurements of the same quantities.…”

“…Optical Moiré interferometry has been used to analyze the thermal deformations and strains of electronics packages e.g., by Han and Post [21], Han and Guo [18], and Zhong et al [22]. Recently, AFM (atomic force microscope) Moiré [23] and SEM (scanning electron microscope) Moiré [24] have also been employed to measure thermal strains of electronics packages.…”

Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique

“…Therefore, advanced experimental techniques are in high demand to provide accurate solutions for deformation studies of microelectronics devices [16]. Validation of numerical models generated by the finite element method is achieved through experimental measurements of the same quantities that are determined computationally.…”

“…Optical Moiré interferometry has been used to inspect thermal deformations and strains of electronics packages [16,19,20]. Recently, atomic force microscope (AFM) Moiré [21][22][23] and scanning electron microscope (SEM) Moiré [24] techniques have also been employed to measure thermal strains of electronics packages.…”

Methods and Systems for High-temperature Strain Measurement of the Main Steam Pipe of a Boiler of a Power Plant While in Service

“…How to accurately measure high temperature strain online without damaging mechanical properties of a pipe surface has been a hot topic that relevant scholars and users are concerned with. As a high temperature field disturbs imaging, it is difficult to apply regular thermal strain measuring methods such as strain gauges, moire interference, electronic speckle interference and holographic interference [1][2][3][4] in this area. Digital image correlation (DIC) [5][6][7][8] is considered as the most promising high temperature whole-field optical measuring method due to its easy installation, low cost and lower susceptibility to high temperature.…”