A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 × 10−2 mm−1 and the sensing patch has a thickness of less than 130 μm and 20 × 20 mm2 dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors.
A novel polymeric bottom anti-reflective coating (PARC) process has been developed for O.25tm Flash device on the severe topology with KrF lithography. The refractive index, n, and the extinction coefficient, k, of PARC can be tuned to match the optical properties of substrates. The CD uniformity range within wafer is O.O27m and the variation is O.OO7tm for the polymer BARC. However, the data from organic ARC is O.O47tm and O.O24tm for the CD uniformity and variation, respectively. The PARC is a uniform and conformal layer of thin film, which significantly improves the CD uniformity of critical layers such as poly Si gate and other features over topography. Since PARC is a highly conformal film, it can be deposited very uniformly across topography. The thickness of PARC is very uniform on the poly Si/TEOS oxide stack of polysilicon gate of a O.25im Flash device with highly topology. In contrast, the thickness of BARC varies from place to place. While the thickness of BARC is very thick in the trough, it becomes quite thin at the top. Such a variation not only decreases the photo process latitude, but also creates a problem for the etch process. Furthermore, the etching rate of PARC is about 200% higher than BARC, so that there is less resist loss during BARC open step.
Circular RNAs (circRNAs) are a novel class of regulatory RNA involved in many biological, physiological and pathological processes by functioning as a molecular sponge, transcriptional/epigenetic/splicing regulator, modulator of protein–protein interactions, and a template for encoding proteins. Cells are constantly dealing with stimuli from the microenvironment, and proper responses rely on both the precise control of gene expression networks and protein–protein interactions at the molecular level. The critical roles of circRNAs in the regulation of these processes have been heavily studied in the past decades. However, how the microenvironmental stimulation controls the circRNA biogenesis, cellular shuttling, translation efficiency and degradation globally and/or individually remains largely uncharacterized. In this review, how the impact of major microenvironmental stresses on the known transcription factors, splicing modulators and epitranscriptomic regulators, and thereby how they may contribute to the regulation of circRNAs, is discussed. These lines of evidence will provide new insight into how the biogenesis and functions of circRNA can be precisely controlled and targeted for treating human diseases.
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