Thionation and fluorination of pyromellitic diimides (PyDIs) increased the electron mobility and on/off ratio of the original diimides by two orders of magnitude and improved the threshold voltage and air-stability of diimide compounds.
This paper systematically discusses the influence of bonding pressure, bonding temperature and humjdity on the adhesion strength of bumpless die (aluminum surface) with two kinds of Anisotropically Conductive Films (ACFs). Evaluated by die shear test, the adhesion strength between the ACFs and aluminum is not affected seriously by bonding pressure but i t increases while bonding temperature increases. Adhesion strength at the ACF/aluminum interface increases while the adhesion at the ACF/glass surface decreases after aging in the same high temperature and high humidity environment. For ACF/aluminum layer, the adhesion enhancement mechanism after humidity aging is discussed by the research results of SAM, SEM & EDX, and XPS. Mositure mainly diffused into aluminum and resulted in oxidation reaction instead of diffusing into adhesive to make it swell. Fewer swelling of adhesive, fewer delaminations occured at the ACF/aluminum surface. So the adhesion strength of shear samples increased after temperaturehumidity exposure. In addition, the oxidation reaction can provide fresh rougher surface that may enhance adhesion strength. ,
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