Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability, and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB). Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the high dielectric constant of ceramics. A novel nanostructure polymer-ceramic composite with a very high dielectric constant ( r ϳ110, a new record for the highest reported r value of a nanocomposite) was developed in this work. A high dielectric constant is obtained by increasing the dielectric constant of the epoxy matrix ( r Ͼ6) and using the combination of lead magnesium niobate-lead titanate (PMN-PT)/BaTiO 3 as the ceramic filler. This nanocomposite has a low curing temperature (Ͻ200°C); thus, it is multichip-module laminate (MCM-L) process-compatible. An embedded capacitor prototype with a capacitance density of 50 nF/cm 2 was manufactured using this nanocomposite and spin-coating technology. The effect of the composite microstructure on the effective dielectric constant was studied. This novel nanocomposite can be used for integral capacitors in PWBs.

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor materials because they combine the processability of polymers with the desired electrical properties of ceramics. We have developed a novel nanostructure polymer-ceramic composite with a very high dielectric constant ( r Ϸ150, a new record for the highest reported r value of a nanocomposite) in a previous work. RF applications of embedded capacitors require that the insulating material have a high r at a high frequency (in the gigahertz range), low leakage current, high breakdown voltage, and high reliability. A set of electrical tests were conducted in this study to characterize the electrical properties of the novel high-r polymer-ceramic nanocomposite developed inhouse. The results show that this material had a fairly high r in the RF range, low electrical leakage, and high breakdown voltage. An 85°C/85% thermal humidity aging test was been performed, and it showed that this novel high-K material had good reliability. An embedded capacitor prototype with a capacitance density of 35 nF/cm 2 was manufactured with this nanocomposite with spin-coating technology. This novel nanocomposite can be used for the integral capacitors for RF applications.

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer–ceramic composite with very high dielectric constant (εr∼150, a new record for the highest reportedεrvalue of nano-composite) has been developed in our previous work. RF application of embedded capacitors requires that insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer–ceramic nano-composite. Results show that this material has faily high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. 85/85 TH aging test has been performed and it had shown this novel high K material has good reliability. An embedded capacitor prototype with capacitance density of35 nF/cm2has been manufactured using this nano-composite with spinning coating technology. This novel nano-composite can be used for the integral capacitors in the RF applications.

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