Novel polymer–ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application

Abstract

Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability, and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB). Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the high dielectric constant of ceramics. A novel nanostructure polymer-ceramic composite with a very high dielectric constant ( r ϳ110, a new record for the highest reported r value of a nanocomposite) was developed in this work. A high dielectric constant is obtained by increasing the dielectric constant of the epoxy matrix ( r Ͼ6) and using the combination of lead magnesium niobate-lead titanate (PMN-PT)/BaTiO 3 as the ceramic filler. This nanocomposite has a low curing temperature (Ͻ200°C); thus, it is multichip-module laminate (MCM-L) process-compatible. An embedded capacitor prototype with a capacitance density of 50 nF/cm 2 was manufactured using this nanocomposite and spin-coating technology. The effect of the composite microstructure on the effective dielectric constant was studied. This novel nanocomposite can be used for integral capacitors in PWBs.

High dielectric insulation coating for time domain reflectometry soil moisture sensor

“…Researchers at Georgia Tech have successfully developed a high dielectric composite with high adhesion, thereby eliminating the major constraint to its use for capacitor applications in organic substrates [Fan et al, 2002;Rao et al, 2002].…”

“…The special base matrix has a typical dielectric constant of 6, which is much higher than 3 $ 4 of an ordinary epoxy matrix. This significantly increases the effective dielectric constant of the composite at a low ceramic loading level [Fan et al, 2002;Rao et al, 2002]. A low ceramic loading (<50% by volume) is important because it increases adhesion of the composite.…”

Electric energy density of dielectric nanocomposites

“…On the other hand, polymers usually enjoy higher breakdown strength but suffer from much smaller permittivity. It is thus not surprising that numerous efforts have been made in the past few years to combine the polymers of high breakdown strength with nanoparticles of high permittivity, [4][5][6][7][8][9][10] with the hope to substantially enhance the electric energy density of the resulting nanocomposites. This approach is appealing for two reasons.…”

Thermally stimulated depolarization currents and dielectric properties of Mg0.95Ca0.05TiO3 filled HDPE composites

“…[6][7][8] However, most studies focus on the preparation of composite materials with expected properties by adjusting their constituent, structure, proportion and processing technique. For microwave applications, low dielectric loss is highly required as it determines the sensitivity and integrity of information transmission, which means understanding the mechanism of dielectric loss is of great importance for improvement in dielectric properties of ceramic-polymer composites.…”