Microchip encapsulation is of dominance in the packaging of Plastic-Encapsulated Microelectronics (PEM). During fabrication of the encapsulation, the sweep deflection of wire bond caused by compound flows obviously results in wire crossover and shorting. Thereby, it is necessary to understand mechanical behaviors of the wire sweep, while it is critical that reduction of the sweep yields clearance of sufficient space between wires.As a rule, a position of a wire with the largest Wire Sweep Index (WSI) possesses the highest possibility of the wire crossover. Recent advances of the encapsulation technologies tend toward smaller scale and higher density, wherein the wire crossover is observed with difficulty. To date, the Computer-Aided Engineering (CAE) technologies have been preferably used in viewing positions of wire crossover.Using the CAE technology, the primary objective of this paper is to develop a useful tool to connect pre-process, filling and structure analyses and post-process, which gives a comprehensive solution for microchip encapsulation. In particular, the wire sweep phenomenon inside the package is found. Furthermore, the CAE users can check the possibility of wire crossover under any processing condition. Thus, application of the CAE technology significantly introducing to mold design for microchip encapsulation is feasible with high reliability.
for microchip encapsulation. In pre-process, parameterized method is provided to create the wire for minimizing efforts in meshing; in Semiconductor industry is one of the most important filling stage, a precise prediction of the branching effects caused by industries in Taiwan for more than one decade. The development of wire and paddle is shown to help users evaluate the design. Moreover, microchip product is complicated due to the complexity of material the information about the welding line, the position of air trap, the properties while processing. During fabrication, various problems velocity vector distribution, and the transfer pressure are obtained. such as wire sweep and paddle shift causing defects will happen. The volumetric shrinkage of thermoset material is also considered in Traditionally, people would get rid of those problems by means of filling analysis for subsequent warpage analysis. Furthermore, in "trial-and-error". However, it is not so easy and effective. Recently, curing analysis, the process of curing and the curing rate can both be using CAE technology in the development of microchip estimated. The prerequisite data for structure analysis about wire encapsulation process is becoming more and more popular. CAE sweep and paddle shift is obtained from results of filling analysis in technology provides a more scientific way to help people solving the Moldex3D IC-Package module. After incorporating structure problems and enhance the development.analyses, the results of wire sweep and paddle shift can be obtained.The results can provide good guideline for the microchip In this paper, the true 3D CAE software, Moldex3D, is encapsulation development. By using this integrated CAE adopted to evaluate the design of microchip encapsulation. As an technology, the physical phenomenon for different molding design of integrated technology to connect pre-process, filling and curing microchip encapsulation can be easily obtained and therefore the analyses, structure analysis and post-process, it gives a most desired design will be found painlessly. comprehensive solution for microchip encapsulation. The results of wire sweep and paddle shift analyses can provide good guideline for the microchip encapsulation development. By using this integrated CAE technology, the physical phenomenon for different molding THREE-DIMENSIONAL FLOW ANALYSIS design of microchip encapsulation can be easily obtained and therefore the most desired design will be found painlessly. Governing Equations: Theoretically, microchip encapsulation process is a threedimensional, transient, reactive problem with moving resin front.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.