Abstract:Microchip encapsulation is of dominance in the packaging of Plastic-Encapsulated Microelectronics (PEM). During fabrication of the encapsulation, the sweep deflection of wire bond caused by compound flows obviously results in wire crossover and shorting. Thereby, it is necessary to understand mechanical behaviors of the wire sweep, while it is critical that reduction of the sweep yields clearance of sufficient space between wires.As a rule, a position of a wire with the largest Wire Sweep Index (WSI) possesses… Show more
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