CAE Analysis for Molding Design of Microchip Encapsulation

Abstract

for microchip encapsulation. In pre-process, parameterized method is provided to create the wire for minimizing efforts in meshing; in Semiconductor industry is one of the most important filling stage, a precise prediction of the branching effects caused by industries in Taiwan for more than one decade. The development of wire and paddle is shown to help users evaluate the design. Moreover, microchip product is complicated due to the complexity of material the information about the welding line, the position of air trap, the properties while processing. During fabrication, various problems velocity vector distribution, and the transfer pressure are obtained. such as wire sweep and paddle shift causing defects will happen. The volumetric shrinkage of thermoset material is also considered in Traditionally, people would get rid of those problems by means of filling analysis for subsequent warpage analysis. Furthermore, in "trial-and-error". However, it is not so easy and effective. Recently, curing analysis, the process of curing and the curing rate can both be using CAE technology in the development of microchip estimated. The prerequisite data for structure analysis about wire encapsulation process is becoming more and more popular. CAE sweep and paddle shift is obtained from results of filling analysis in technology provides a more scientific way to help people solving the Moldex3D IC-Package module. After incorporating structure problems and enhance the development.analyses, the results of wire sweep and paddle shift can be obtained.The results can provide good guideline for the microchip In this paper, the true 3D CAE software, Moldex3D, is encapsulation development. By using this integrated CAE adopted to evaluate the design of microchip encapsulation. As an technology, the physical phenomenon for different molding design of integrated technology to connect pre-process, filling and curing microchip encapsulation can be easily obtained and therefore the analyses, structure analysis and post-process, it gives a most desired design will be found painlessly. comprehensive solution for microchip encapsulation. The results of wire sweep and paddle shift analyses can provide good guideline for the microchip encapsulation development. By using this integrated CAE technology, the physical phenomenon for different molding THREE-DIMENSIONAL FLOW ANALYSIS design of microchip encapsulation can be easily obtained and therefore the most desired design will be found painlessly. Governing Equations: Theoretically, microchip encapsulation process is a threedimensional, transient, reactive problem with moving resin front.