Single crystals of lead magnesium niobate–lead titanate, Pb(Mg1/3Nb2/3)O3–PbTiO3 (PMN–PT), have superior dielectric and piezoelectric properties suitable for medical ultrasound imaging. Imaging devices with superior performance can be manufactured from thinner PMN–PT single crystals by mechanical dicing and/or polishing. Although it is often a concern that a damaged layer may form during the mechanical dicing and/or thinning process, the microscopic characteristics of the damaged layer have not yet been investigated in detail. In this study, the microstructural characterization of a damaged layer was investigated by transmission electron microscopy. It was found that mechanical polishing introduced dislocation near the surface of the crystal. It was also found that the domain structure was affected by the introduction of dislocation.
A family of TeO2-based glasses is known to have high third-order nonlinear properties and expected as nonlinear optical devices. In the present study, we fabricated Ag2O-TeO2 and Ag2O-Nb2O5-TeO2 glasses, and estimated their structures and linear/nonlinear optical properties. The main results showed that the absorption-edge of the glasses was shifted to longer wavelength side with increasing Ag2O content. By Raman spectroscopy, it was found that an increase in Ag2O content promoted to change TeO4 to TeO3/TeO3+1 units. X-ray photoelectron spectroscopy (XPS) revealed the presence of an electronic state of Ag2+ ions, which was supposed to have a large influence on the absorption-edge wavelength. In Ag2O-Nb2O5-TeO2 glass system, the third-order nonlinear susceptibility χ(3) increased with increasing Ag2O content at the expense of Nb2O5 content.
We investigated a planarization process for the production of an MCM viapost interconnection type thin film multilayer substrate using resist as the planar sacnfical layer. The D.0.P (Degree of Planarization) of the polyimide and resist was investigated as a first step, and it was found that a higher D.O.P. was obtained by reducing the spin rotation and shortening the spin time of the spin coat. Next, the etching rate of the polyimide and resist were studied. It was found that when 0, gas was used the etching rate of the polyimide was faster than that of the resist, but that the etching rate of the polyimide was faster than that of the resist when CF, gas was used. We also found conditions at which the etching rate of the resist and polyimide were both at a maximum and at about the same Ievel. Wiring substrates were manufactured and subjected to temperature cycle test (-65 "C -+125 "C) to evaluate circuit connection reliability. The rate of change in connection resistance was less than +3% after IO00 test cycles, indicating an excellent substrate quality. The transmission characteristics of the stripline were also investigated.
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