Local bandgap tuning in two-dimensional (2D) materials is of significant importance for electronic and optoelectronic devices but achieving controllable and reproducible strain engineering at the nanoscale remains a challenge. Here, we report on thermomechanical nanoindentation with a scanning probe to create strain nanopatterns in 2D transition metal dichalcogenides and graphene, enabling arbitrary patterns with a modulated bandgap at a spatial resolution down to 20 nm. The 2D material is in contact via van der Waals interactions with a thin polymer layer underneath that deforms due to the heat and indentation force from the heated probe. Specifically, we demonstrate that the local bandgap of molybdenum disulfide (MoS 2 ) is spatially modulated up to 10% and is tunable up to 180 meV in magnitude at a linear rate of about −70 meV per percent of strain. The technique provides a versatile tool for investigating the localized strain engineering of 2D materials with nanometer-scale resolution.

Two-dimensional (2D) layered molybdenum ditelluride (MoTe 2 ) crystals, featuring a low energy barrier in the crystalline phase transition and a sizable band gap close to that of silicon, are rapidly emerging with substantial potential and promise for future nanoelectronics. It has been challenging, however, to realize n-type MoTe 2 field-effect transistors (FETs), thus complementary logic, because MoTe 2 FETs mainly exhibit p-type behavior. Here, we report a dopant-free method for controlling polarity of MoTe 2 FETs by modifying Schottky barriers at their MoTe 2 −metal contacts via thermal annealing. Upon annealing, MoTe 2 FETs encapsulated by hexagonal boron nitride (h-BN) are consistently changed from hole to electron conduction, displaying an on/off current ratio of 10 5 or higher. When the MoTe 2 channel is sandwiched between top and bottom h-BN thin layers (h-BN/MoTe 2 /h-BN FETs), higher field-effect mobility is attained, up to 48.1 cm 2 V −1 s −1 (hole) and 52.4 cm 2 V −1 s −1 (electron) before and after thermal annealing, respectively. The thermally controlled FET polarity change further enables high-performance MoTe 2 monolithic complementary inverters with gain as high as 36, suggesting this simple and effectual approach may lead to compelling possibilities of rationally controlling transport polarity, on demand, in atomically thin transistors with metal contacts and their 2D integrated circuits.

Atomically thin semiconductors such as transition metal dichalcogenides have recently enabled diverse devices in the emerging two-dimensional (2D) electronics. While scalable 2D electronics demand monolithic integrated circuits consisting of complementary p-type and n-type transistors, conventional p-type and n-type doping in desired regions, monolithically in the same semiconducting atomic layers, remains elusive or impractical. Here, we report on an agile, high-precision scanning laser annealing approach to realizing 2D monolithic complementary logic circuits on atomically thin MoTe2, by reliably designating p-type and n-type transport polarity in the constituent transistors via localized laser annealing and modification of their Schottky contacts. Pristine p-type field-effect transistors (FETs) transform into n-type ones upon controlled laser annealing on their source/drain gold electrodes, exhibiting a mobility of 96.5 cm2 V–1 s–1 (the highest known to date) and an On/Off ratio of 106. Elucidation and validation of such an on-demand configuration of polarity in MoTe2 FETs further enable the construction and demonstration of essential logic circuits, including both inverter and NOR gates. This dopant-free, spatially precise scanning laser annealing approach to configuring monolithic complementary logic integrated circuits may enable programmable functions in 2D semiconductors, exhibiting potential for additively manufactured, scalable 2D electronics.

The science and engineering of two-dimensional materials (2DMs), in particular, of 2D semiconductors, is advancing at a thriving pace. It is well known that these delicate few-atoms thick materials can be damaged during the processing toward their integration into final devices. Thermal scanning probe lithography (t-SPL) is a gentle alternative to the typically used electron beam lithography to fabricate these devices avoiding the use of electrons, which are well known to deteriorate the 2DMs’ properties. Here, t-SPL is used for the fabrication of MoS2-based field effect transistors (FETs). In particular, the use of t-SPL is demonstrated for the first time for the fabrication of edge-contact MoS2 FETs, combining the hot-tip patterning and Ar+ milling to etch the 2DM. To avoid contamination of the contact interface by atmospheric gas molecules, etching and metal deposition are performed without breaking the vacuum conditions in between. With this process, edge-contact MoS2 FETs are successfully fabricated and characterized. On/off ratios up to 108 and 109 are obtained at room temperature in air and vacuum, respectively, i.e., comparable with the best values reported in the literature.