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This study demonstrates that the surface tension of plating solutions should be optimized to achieve a compromise between the gap-filling capability of copper electroplating and the formation of copper-void defects. The plating solution with lower surface tension has better gap filling but generates more air bubbles during copper electroplating. For a low-surface-tension electrolyte, the improvement in the gap-filling capability is caused by the enhancement in the ability of fluids to wet high-aspect-ratio features, whereas the increase in the formation of copper-void defects results from more air bubbles generated during the electroplating process. This study provides a model to describe the role of surface tension in copper electroplating.

In this study, different proportions of silver-palladium alloy acting as the inner electrode were adopted to a (Zn,Mg)TiO3-based multilayer ceramic capacitor (MLCC) sintered at 925 °C for 2 h to evaluate the effect of the inner electrode on reliability. The main results show that the lifetime is inversely proportional to Ag content in the Pd/Ag inner electrode. Ag+1 diffusion into the (Zn,Mg)TiO3-based MLCC during cofiring at 925 °C for 2 h and Ag+1 migration at 140 °C against 200 V are both responsible for the short lifetime of the (Zn,Mg)TiO3-based MLCC, particularly the latter factor. A (Zn,Mg)TiO3-based MLCC with high Ag content in the inner electrode Ag/Pd=99/01 exhibits the shortest lifetime (13 h), and the effect of Ag+1 migration is markedly enhanced when the activation energy of the (Zn,Mg)TiO3 dielectric is greatly lowered due to the excessive formation of oxygen vacancies and the semiconducting Zn2TiO4 phase when Ag+ substitutes for Zn+2 during co-firing.

In this study, (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 multilayer ceramic capacitors (MLCCs) with different proportions of a silver (Ag)–palladium (Pd) mixture acting as the inner electrode were sintered at 925°C for 2 h to evaluate the effect of the inner electrode on reliability. The main results reveal that the lifetime is inversely proportional to the Ag content in the Ag/Pd inner electrode. Ag diffusion into the (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 MLCC during cofiring at 925°C for 2 h and Ag migration at 140°C against 200 V are both responsible for the short lifetime of the (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 MLCC, particularly the latter factor. A Bi,Sb‐rich secondary phase was present at the triple junction and a small amount of Ag was detected from the second phase for a (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 MLCC with a high Ag content in the inner electrode of Ag/Pd=99/01. However, this was not the case with a low Ag content in the inner electrode of Ag/Pd=90/10. This means that the Bi,Sb‐rich second phase plays an important role in determining the degradation of insulation resistance due to the excessive formation of oxygen vacancies from the reaction of Ag+ for Bi3+ or Sb5+ substitution to lower the activation energy of the (Zn,Mg)TiO3+Bi2O3+Sb2O5 dielectrics and to enhance markedly the effect of Ag migration.