2007
DOI: 10.1111/j.1551-2916.2007.01799.x
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Characterization of Silver Interdiffusion into (Zn,Mg)TiO3+x:Bi:Sb Multilayer Ceramic Capacitor

Abstract: In this study, (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 multilayer ceramic capacitors (MLCCs) with different proportions of a silver (Ag)–palladium (Pd) mixture acting as the inner electrode were sintered at 925°C for 2 h to evaluate the effect of the inner electrode on reliability. The main results reveal that the lifetime is inversely proportional to the Ag content in the Ag/Pd inner electrode. Ag diffusion into the (Zn,Mg)TiO3+x+Bi2O3+Sb2O5 MLCC during cofiring at 925°C for 2 h and Ag migration at 140°C against 200 V are … Show more

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Cited by 4 publications
(2 citation statements)
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References 14 publications
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“…The process is exposed as two firing steps: the binder burnout, which normally take place at around at 500 and 600 °C to remove organics, and the cofiring of ceramic and metallic phase which occurs above 850–1050 °C. There are many studies reporting interdiffusion taking place during firing because the sintering temperature is very close to the melting temperature of metals, especially when cofiring with Ag and Cu, which have melting points of 961 and 1084 °C, respectively. ,, Here, by use of the cold sintering, the LTCC processing is performed at extremely low temperatures below 300 °C, which well below the melting points of Cu, Fe, and Al metals that are used as a metal layers in this study. As depicted in TEM analysis (Figures and )­, the interfaces of ceramic/metal and metal/ceramic are very clear, and no chemical and physical interdiffusions of the adjacent layers are observed.…”
Section: Resultsmentioning
confidence: 99%
“…The process is exposed as two firing steps: the binder burnout, which normally take place at around at 500 and 600 °C to remove organics, and the cofiring of ceramic and metallic phase which occurs above 850–1050 °C. There are many studies reporting interdiffusion taking place during firing because the sintering temperature is very close to the melting temperature of metals, especially when cofiring with Ag and Cu, which have melting points of 961 and 1084 °C, respectively. ,, Here, by use of the cold sintering, the LTCC processing is performed at extremely low temperatures below 300 °C, which well below the melting points of Cu, Fe, and Al metals that are used as a metal layers in this study. As depicted in TEM analysis (Figures and )­, the interfaces of ceramic/metal and metal/ceramic are very clear, and no chemical and physical interdiffusions of the adjacent layers are observed.…”
Section: Resultsmentioning
confidence: 99%
“…It is well known that silver migration into ceramics in the cofiring process of low sintering temperature MLCCs is another important reason that influences the reliability and dielectric characteristics. [14][15][16][17] In this paper, the effects of heating rate and two-step sintering on the sintering behaviour, microstructure and silver diffusion of ZMT MLCC with pure silver electrodes were investigated.…”
Section: Introductionmentioning
confidence: 99%