An InP-based photoreceiver comprising a waveguide-integrated photodiode and a traveling-wave amplifier is presented, which allows dc-coupled interfacing to subsequent electronics without a bias-T. Getting rid of the bias-T provides cost savings of the receiver operations and improves the available bandwidth, gain and gain flatness. The redesigned receiver optoelectronic integrated circuit was fully packaged into a pigtailed module with a coaxial 1.85-mm connector. Its optoelectronic conversion capability for nonreturn-to-zero modulated data rates up to 66 Gb/s is shown
40-Gbit/s photoreceiver modules for 1.55- mu m TDM system applications covering RZ and NRZ coding are described. The modules contain an InP-OEIC with a monolithic integration of a waveguide-integrated photodiode and a traveling-wave amplifier
The structural properties of GaAs, InAs, GaP, and InP implanted by Fe or Ti at 150 keV/400 keV and doses of 1012–1×1015 cm−2 and the depth distribution of the implants are comparatively studied before and after annealing with and without a Si3N4 cap. Results of Rutherford backscattering, x-ray double-crystal diffractometry, and secondary-ion mass spectroscopy experiments are presented. Fe redistributes strongly in all materials upon annealing, Ti does not redistribute at all. The driving force of redistribution of Fe is not classical diffusion but reaction with implantation-induced defects and stoichiometric imbalances. The actual defect chemistry of the as-implanted arsenides is found to be fundamentally different from the as-implanted phosphides since in the latter case the mass ratio of the constituents is much larger and the specific energy for amorphization is much lower. Consequently, redistribution of Fe in the phosphides and the arsenides differs qualitatively from each other.
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