Organic Conductors Achieving excellent electrical, mechanical, and self‐healing properties with soft conductor has been challenging so far. In article number 2205485 , Jarkko Tolvanen and co‐workers report a co‐continuous multiphase design strategy for self‐healable organic conductor‐elastomer blend that achieves a good overall performance. The cover displays structure of the heterogenous multiphase conductor with microdroplet morphology captured by optical microscopy.
Next-generation, truly soft, and stretchable electronic circuits with material level self-healing functionality require high-performance solution-processable organic conductors capable of autonomously self-healing without external intervention. A persistent challenge is to achieve required performance level as electrical, mechanical, and self-healing properties optimized in tandem are difficult to attain. Here heterogenous multiphase conductor with cocontinuous morphology and macroscale phase separation for ultrafast universally autonomous self-healing with full recovery of pristine tensile and electrical properties in less than 120 and 900 s, respectively, is reported. The multiphase conductor is insensitive to flaws under stretching and achieves a synergistic combination of conductivity up to ≈1.5 S cm −1 , stress at break ≈4 MPa, toughness up to >81 MJ m −3 , and elastic recovery exceeding 2000% strain. Such properties are difficult to achieve simultaneously with any other type of material so far. The solution-processable multiphase conductor offers a paradigm shift for damage tolerant and environmentally resistant soft electronic components and circuits with material level self-healing.
In this paper, a novel low-temperature sintering substrate for low temperature co-fired ceramic applications based on indialite/cordierite glass ceramics with Bi 2 O 3 as a sintering aid showing low permittivity (ε r ) and ultralow dielectric loss (tan δ) is described. The fine powder of indialite was prepared by the crystallization of cordierite glass at 1000°C/1 h. The optimized sintering temperature was 900°C with 10 wt % Bi 2 O 3 addition. The relative density achieved was 97%, and ε r and tan δ were 6.10 and 0.0001 at 1 MHz, respectively. The composition also showed a moderately low temperature coefficient of relative permittivity of 118 ppm/°C at 1 MHz. The obtained linear coefficient of thermal expansion was 3.5 ppm/°C in the measured temperature range of 100 to 600°C. The decreasing trend in dielectric loss, the low relative permittivity at 1 MHz, and the low thermal expansion of the newly developed composition make it an ideal choice for radio frequency applications.
This paper reports the first ultralow sintering temperature (450 °C) cofired multifunctional ceramic substrate based on a commercial lead zirconium titanate (PZ29)-glass composite, which is fabricated by tape casting, isostatic lamination, and sintering. This substrate was prepared from a novel tape casting slurry composition suitable for cofiring at low temperatures with commercial Ag electrodes at 450 °C. The green cast tape and sintered substrate showed a surface roughness of 146 and 355 nm, respectively, suitable for device-level fabrication by postprocessing. Additionally, the ferroelectric and piezoelectric studies disclosed low remnant polarization due to the dielectric glass matrix with average values of piezoelectric coefficient (+ d) and voltage coefficient (+ g) of 17 pC/N and 30 mV/N, respectively. The dielectric permittivity and loss value of the sintered substrates were 57.8 and 0.05 respectively, at 2.4 GHz. The variation of relative permittivity on temperature dependence in the range of -40 to 80 °C was about 23%, while the average linear coefficient of thermal expansion was 6.9 ppm/°C in the measured temperature range of 100-300 °C. Moreover, the shelf life of the tape over 28 months was studied through measurement of the stability of the dielectric properties over time. The obtained results open up a new strategy for the fabrication of next-generation low-cost functional ceramic devices prepared at an ultralow temperature in comparison to the high-temperature cofired ceramic and low-temperature cofired ceramic technologies.
High-temperature cofired ceramics and low-temperature cofired ceramics are important technologies in the fabrication of multilayer ceramic substrates for discrete devices, electronics packages, and telecommunications. However, there is a place and need for materials with lower fabrication temperatures to decrease the associated energy consumption. The present paper studies the feasibility of two ultra-low sintering temperature cofired ceramic materials, copper molybdate and copper molybdate–Ag2O, sinterable at 650 and 500 °C, respectively, for multilayer substrates using tape casting. The slurry composition developed uses environmentally friendly organics and a nontoxic binder and solvent. Additionally, the green cast tapes exhibit very low residual carbon (less than 5%) after sintering on analysis by X-ray photoelectron spectroscopy. The multilayer substrates show a permittivity value of about 8 with a low dielectric loss in the range of 10–5 to 10–4 in the frequency range of 2–10 GHz along with a low coefficient of thermal expansion in the range of 4–5 ppm/°C and good compatibility with an Al electrode. Thus, these proposed substrates have much promise, with good thermal, mechanical, and dielectric properties comparable to commercial substrates while also providing an energy and environment-friendly solution.
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