Ultimately soft electronics seek affordable and high mechanical performance universal self‐healing materials that can autonomously heal in harsh environments within short times scales. As of now, such features are not found in a single material. Herein, interpenetrated elastomer network with bimodal chain length distribution showing rapid autonomous healing in universal conditions (<7200 s) with high efficiency (up to 97.6 ± 4.8%) is reported. The bimodal elastomer displays strain‐induced photoelastic effect and reinforcement which is responsible for its remarkable mechanical robustness (≈5.5 MPa stress at break and toughness ≈30 MJ m−3). The entropy‐driven elasticity allows an unprecedented shape recovery efficiency (100%) even after fracturing and 100% resiliency up to its stretching limit (≈2000% strain). The elastomers can be mechanically conditioned leading to a state where they recover their shape extremely quickly after removal of stress (nearly order of magnitude faster than pristine elastomers). As a proof of concept, universal self‐healing mechanochromic strain sensor is developed capable of operating in various environmental conditions and of changing its photonic band gap under mechanical stress.

Self‐Healing Elastomers Soft electronics seek all‐around high mechanical performance universal self‐healing elastomers. In article number 2103235, Jarkko Tolvanen and co‐workers report design strategy to achieve tough and resilient universal self‐healing elastomer. The resilin‐inspired bimodal siloxane‐based elastomer benefits from combination of soft and hard phases. The cover displays existing phase‐separated morphology during shape recovery captured by optical microscopy.

Organic Conductors Achieving excellent electrical, mechanical, and self‐healing properties with soft conductor has been challenging so far. In article number 2205485 , Jarkko Tolvanen and co‐workers report a co‐continuous multiphase design strategy for self‐healable organic conductor‐elastomer blend that achieves a good overall performance. The cover displays structure of the heterogenous multiphase conductor with microdroplet morphology captured by optical microscopy.

Next-generation, truly soft, and stretchable electronic circuits with material level self-healing functionality require high-performance solution-processable organic conductors capable of autonomously self-healing without external intervention. A persistent challenge is to achieve required performance level as electrical, mechanical, and self-healing properties optimized in tandem are difficult to attain. Here heterogenous multiphase conductor with cocontinuous morphology and macroscale phase separation for ultrafast universally autonomous self-healing with full recovery of pristine tensile and electrical properties in less than 120 and 900 s, respectively, is reported. The multiphase conductor is insensitive to flaws under stretching and achieves a synergistic combination of conductivity up to ≈1.5 S cm −1 , stress at break ≈4 MPa, toughness up to >81 MJ m −3 , and elastic recovery exceeding 2000% strain. Such properties are difficult to achieve simultaneously with any other type of material so far. The solution-processable multiphase conductor offers a paradigm shift for damage tolerant and environmentally resistant soft electronic components and circuits with material level self-healing.

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Memristors have attracted significant interest in recent years because of their role as a missing electronic component and unique functionality that has not previously existed. Since the first discoveries of the existence of memristive materials, various different fabrication processes for memristors have been presented. Here, a simple additive fabrication process is demonstrated where memristors were deposited on a polymer substrate by conventional inkjet printing. The memristor structure was printed on a 125 μm thick polyethylene terephthalate (PET) substrate by sandwiching a thin layer of TiO x between two silver nanoparticle ink electrodes. Current-voltage (IV) characterization measurements were performed and they showed clear memristive behavior when voltage pulse amplitude varied between −1.5 V and 1.5 V. The corresponding resistance change is approximately between 150 Ω and 75 kΩ. In order to demonstrate the switching scheme in practical application, printed memristors and a printed voltage doubler were connected with a piezoelectric element. The element was subjected to impact-type excitation thus producing an electric charge that was able to switch the memristor between high and low resistive states. These results pave the way for an exploitation of cost-efficient, self-sufficient, all-printable memory elements for wide utilization in future electronics applications.

In this research a composite for printable capacitors using screen printed structures and low temperature curing ferroelectric ink was investigated. The realized ink consisted of 40 vol-% barium titanate in a poly(vinylidenefluoride-trifluoroethylene) matrix. DuPont silver ink 5064H was used for the conductive lines in the design and the maximum process temperature was 130 °C. The thickness of the composite and the area of the printed capacitor were 43 μm and area 25 mm 2 , respectively. The obtained relative permittivity of the composite was 46 and the tan δ was 0.15 at 1 MHz. Additionally, the microstructure of the composite was investigated and the temperature dependence of the dielectric properties measured. The capacitance of the parallel plate structure was approximately 200 pF at 1 MHz. This is easily adjustable by changing the printing pattern, number of layers or the filler loading. The freedom of choice in integration and capacitance value selection makes the ink highly usable in, for example, decoupling capacitors that are compatible with inorganic, organic and even flexible, substrates.