Thin films of (Ba0.65Sr0.35)TiO3 (BST) have been prepared by an rf-sputtering method at substrate temperatures of 500 to 700°C. The dielectric constant of these films ranges from 190 to 700 at room temperature. This value changes with the grain size rather than the film thickness. The dielectric constant of about 300 and leakage current density of about 1×10-8 A/cm2 are obtained in the 65-nm-thick film deposited at a substrate temperature of 600°C. This shows the BST film can be applied to dielectrics of dynamic random access memory (DRAM) capacitors.
Dielectric properties of (Ba0.5Sr0.5)TiO3 and (Ba0.75Sr0.25)TiO3 thin films have been investigated, focusing on the effects of film structure and Ba/Sr compositions on the dielectric properties. Dielectric constant of the films increased with increasing grain size and with improvement in film crystallinity. For the 50-nm-thick films deposited at 660° C, the dielectric constant of 400 for the (Ba0.5Sr0.5)TiO3 film is larger than that of 320 for the (Ba0.75Sr0.25)TiO3 film. This indicated that dielectric constant is affected by the ratio of Ba/Sr composition. Leakage current density of less than 1×10-7 A/cm2 at 1 V and SiO2 equivalent thickness of 0.38 nm are measured at 120° C for 660° C-deposited (Ba0.5Sr0.5)TiO3 film of 30 nm in thickness. The (Ba0.5Sr0.5)TiO3 film has the possibility for application to generations beyond 256 Mbit dynamic random access memories.
The dielectric relaxation of (Ba0.5Sr0.5)TiO3 thin films with high electric resistivity is investigated. The films are deposited by an rf-magnetron sputtering method in an atmosphere of argon and oxygen. The dielectric dispersion of the films is measured in the frequency range of 10-2-106 Hz. It is found that the dielectric constant ε slightly decreases with frequency, following the relationship of dε/d(log
10
f)∼-0.01ε, and the dielectric loss is almost constant at less than 1% in the measured frequency range. This type of dielectric relaxation causes absorption current which is inversely proportional to time, as the result of the dielectric aftereffect. In a dynamic random access memory (DRAM) operation, the dielectric relaxation would result in less than 10% loss of storage charge during the refresh cycle, and the film's DC leakage less affects the device operation.
Thin films of (Ba, Sr)TiO3 (BST) with high dielectric constant were prepared on Pt/ SiO2/Si substrates of 6-inch-diameter by liquid source chemical vapor deposition using Ba(DPM)2, Sr(DPM)2 and TiO(DPM)2 (DPM=dipivaloylmethanato; C11H19O2) dissolved in tetrahydrofuran (THF). The reproducibility of ±3 % for the film composition was achieved by optimizing the deposition procedures. It was found that the coverage of 72%, obtained at the substrate temperature T
s=753 K, was better than those obtained using other Ti sources such as Ti(O-i-Pr)4 (TTIP) and Ti(O-i-Pr)2(DPM)2. The electrical properties of the 480-Å-thick BST film, deposited at T
s=753 K using TiO(DPM)2, were as follows: dielectric constant ε=230, equivalent SiO2 thickness t
eq=7.8 Å, leakage current density J
L=6.7×10-6 A/cm2 at 1.65 V and dielectric loss tan
δ=0.013.
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