Surface texturing methods using an alkaline solution for monocrystalline Si (c-Si) solar cells have been widely accepted to improve cell performance. However, multicrystalline Si (mc-Si) cells are difficult to be texturized by alkaline etching, because the grains in the substrates are randomly oriented. In this study, we considered a HF/HNO3/H2SO4acid solution for texturing the mc-Si cells. We evaluated the morphology of the textured surfaces and the reflectance spectra from the surfaces. The deep dimple textured structures are formed on the surfaces for only 30 seconds of the acid texturing process. This behavior results from the effect of H2SO4in the solution. This process obtains up to 14.7% conversion efficiencies of the acid textured cells. These conversion efficiencies are up to 1.3 times larger than those of the mirror-etched cells.
3 formulated etchants were prepared and their etch rates were measured using blanket wafers in order to confirm that the etching reactions on Si1-XGeX and Si are controllable. Si1-XGeX selective etching with those formulations was also verified using the wafers which had Si1-XGeX and Si multi-stacked structures. Cross-sectional transmission electron microscope (TEM) images suggested that the formulations were usable for Si1-XGeX selective etching processes.
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